Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Furui Precise Component (kunshan) Co., Ltd.

Yi-Shih Hsieh

Rui-Wen Sun

Fa-Yin Yan

Peng Qiao

An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.

Heat dissipation device

A heat pipe includes a sealed casing, a sealed vesicle received in the sealed casing, and a working fluid contained in the sealed vesicle. The sealed casing includes an evaporating section, a condensing section, and a connecting section connecting the evaporating section and the condensing section. The sealed vesicle is made of soft metal. The sealed vesicle comprising a heat absorbing portion attached to the evaporating section, a heat dissipating portion attached to the condensing section, and an uneven portion connecting the heat absorbing portion and the condensing section.

Heat pipe with sealed vesicle

A method of obtaining accurately a heat-dissipating requirement for electronic systems of a same kind uses a thermal analysis software, a passed thermal module with a fan, and a fan speed regulating device. The method includes steps of: (1) connecting the fan to the fan speed regulating device; (2) turning on one electronic system and running the fan, monitoring the electronic system; (3) reducing the speed of the fan until the electronic system is shut down, recording the fan speed; (4) getting a thermal resistance (Ri) of the thermal module when it runs in an open space with the fan running at the speed at which the electronic system is shut down; (5) repeating above four steps to get some Ri's of some other such electronic systems; (6) using the thermal analysis software to analyze the Ri's of the electronic systems and getting accurately the heat-dissipating requirement for the electronic systems.

Method of obtaining accurately a heat-dissipating requirement for electronic systems

A heat dissipating device includes a circuit board (), an electronic component () being arranged on the circuit board, a base () being thermally attached to the electronic component, and a plurality of fasteners (). The circuit board defines a plurality of screw holes () therein. The base defines a plurality of through holes () corresponding to the screw holes of the circuit board. Each fastener includes a bolt () extending through a corresponding through hole of the base and then threadly engaging into a corresponding screw hole of the circuit board, and a coil spring () mounted around the bolt. The base forms a plurality of latch hooks () near each through hole. A bottom ring () of the coil spring is sandwiched between the latch hooks and the base.

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Taipei Hsien, Taiwan

Yi-Shih Hsieh