Taiwan Semiconductor Manufacturing Comp. Ltd.

E Ink Holdings Inc.

Macroblock, Inc.

Food Industry Research and Development Institute

Force Mos Technology Co., Ltd.

Orange Electronic Co., Ltd

Yi-Sheng Lin

Chun-Wei Hsu

Chi-Jen Liu

Liang-Guang Chen

Chia-Chun Yeh

Kei-Wei Chen

Chia-Wei Ho

Pinlei Edmund Chu

Chi-Hsiang Shen

Yang-Chun Cheng

Ling-Fu Nieh

William Weilun Hong

Li-Chang Yang

Chen-Chu Tsai

Hsing-Kai Wang

Kuo-Hsing Cheng

Kuan-Yi Lin

Te-Ming Kung

Ting-Hsun Chang

Jinn-Tsyy Lai

Jian-Ci Lin

Li-Chieh Wu

Yu-Wen Chen

Kuo-Hsiu Wei

Chun-Yu Lu

Shie-Jea Lin

Chia Hsuan Lee

Yu-Chieh Hung

Cheng-Chun Chang

Guey-Yuh Liou

Yu-Chen Cheng

Chiao-Ying Huang

Hung-Chih Yu

Ji Cui

Kao-Way Tu

Yung-Sheng Chang

Yuan-Shun Chang

Jeng-Chi Lin

Chih-chieh Chang

Rong-Tsung Lin

Chen Chu Tsai

Po-Yu Hsiao

Kuo Chang Lee

Hsiao-Ping Kuo

Shyue-Tsong Huang

An-Chi Wu

A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.

Semiconductor device cleaning solution, method of use, and method of manufacture

A flexible display device includes a supporting layer and a flexible display panel. The supporting layer has two non-folding regions and a folding region between the two non-folding regions. The folding region has a central region and two edge regions. Each of the edge regions is located between one of the two non-folding regions and the central region, and open porosities of the two edge regions are different from an open porosity of the central region. The flexible display panel is located on the supporting layer.

Flexible display device having supporting layer

A display device includes a driving substrate, an electronic ink layer, and a conductive barrier layer. The electronic ink layer is located on the driving substrate. The conductive barrier layer is located on the electronic ink layer, the conductive barrier layer includes a conductive layer and a base layer, the conductive layer is located between the base layer and the electronic ink layer, and the conductive layer is separated from the electronic ink layer.

Display device and fabrication method of the same

The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.

Metal heterojunction structure with capping metal layer

A light emitting display device includes a substrate, a drive power circuit, a gate circuit unit, multiple LEDs and a power switch unit. The power switch unit includes multiple first transistor switches and at least one second transistor switch that cooperatively control current flows through the LEDs. The first transistor switches are respectively connected to first terminals of the LEDs. The at least one second transistor switch is connected to second terminals of the LEDs. The first transistor switches are further connected to the drive power circuit to receive multiple drive currents, and are further connected to the gate circuit unit to receive a timing input. The at least one second transistor switch is further connected to the gate circuit unit to receive a timing input. The light emitting display device can have reduced parasitic capacitance effect, and thus reduced power consumption and have improved display quality.

Light emitting display device

A slurry composition, a semiconductor structure and a method for forming a semiconductor structure are provided. The slurry composition includes a slurry and a precipitant dispensed in the slurry. The semiconductor structure comprises a blocking layer including at least one element of the precipitant. The method includes using the slurry composition with the precipitant to polish a conductive layer and causing the precipitant to flow into the gap.

Slurry composition, semiconductor structure and method for forming the same

An LED display device includes a system board, and multiple daughterboards that are assembled on the system board. The system board includes a drive power circuit, a first gate circuit and a second gate circuit. Each daughterboard includes a substrate, multiple LEDs that are disposed on the substrate, multiple first transistor switches that are respectively connected to the LEDs, and at least one second transistor switch that is connected to the LEDs. With respect to each daughterboard, the first transistor switches and the at least one second transistor switch cooperatively control current flows through the LEDs; the first transistor switches are further connected to the drive power circuit to respectively receive multiple drive currents, and are further connected to the first gate circuit to receive a timing signal; and the at least one second transistor switch is further connected to the second gate circuit to receive a timing signal.

Light emitting diode display device

A flexible display panel can be bent around an axis, and includes a flexible substrate and an accommodating structure. The accommodating structure is disposed on the flexible substrate and includes a plurality of polygonal microcups connected to each other, where the polygonal microcups are arranged regularly, and the axis is not substantially parallel to any sidewall of each polygonal microcup.

Flexible display panel

A method of building a model of defect inspection for a light-emitting diode (LED) display is adapted to be implemented by a model-building system. The model-building system stores captured images respectively of LED displays that were displaying images. Each of the captured images corresponds to a status tag that indicates a status of the image being displayed by the respective one of the LED displays. The method includes: performing data preprocessing on the captured images to result in pieces of pre-processed data that respectively correspond to the captured images; and building a model of defect inspection by using an algorithm of machine learning based on the pieces of pre-processed data and the status tags.

Method of building model of defect inspection for LED display

A method for packaging an integrated circuit chip includes the steps of: a) providing a plurality of dies and a lead frame which includes a plurality of bonding parts each having a die pad, a plurality of leads each having an end region disposed on and connected to the die pad, and a plurality of bumps each disposed on the end region of a respective one of the leads; b) transferring each of the dies to the die pad of a respective one of the bonding parts to permit each of the dies to be flipped on the respective bonding part; and c) hot pressing each of the dies and the die pad of a respective one of the bonding parts to permit each of the dies to be bonded to the bumps of the respective bonding part.

Method for packaging integrated circuit chip

An electronic apparatus includes a flexible display device and a roller. The flexible display device includes a driving substrate, a display layer on the driving substrate, and a front protective layer covering the display layer. The flexible display device has an end portion fixed to the roller. The roller includes a holding groove, a receiving slot, and a retraction assembly. The holding groove is recessed from an external surface of the roller. The end portion is in the holding groove. The flexible display device further includes a main body portion outside the holding groove. A thickness of the end portion is less than a thickness of the main body portion. The receiving slot is recessed from the external surface. The retraction assembly is disposed in the receiving slot. When the retraction assembly abuts against the flexible display device, the retraction assembly is pressed into the receiving slot.

Electronic apparatus

A display device includes a flexible display panel, a sealant, and a first reinforcing structure. The flexible display panel includes a lower substrate, an upper substrate, and a display medium layer disposed between the lower substrate and the upper substrate. Each of the lower substrate and the upper substrate has an edge region. A centerline of the flexible display panel is parallel to a short side of the flexible display panel. The sealant is disposed between the edge region of the lower substrate and the edge region of the upper substrate. The first reinforcing structure is disposed among the sealant, the edge region of the lower substrate, and the edge region of the upper substrate. The centerline of the flexible display panel passes through the first reinforcing structure, and the elastic modulus of the first reinforcing structure is greater than that of the sealant.

Display device

A display apparatus including a display panel and a display driver is provided. The display driver is coupled to the display panel. The display driver is configured to drive the display panel by at least one of a plurality of gray levels to display an image frame in a first state. The display driver is configured to drive the display panel by a predetermined gray level to display a standby frame in a second state. The display driver determines the predetermined gray level of the standby frame according to the gray levels of the image frame. In addition, a driving method of a display apparatus is also provided.

Display apparatus and driving method thereof

A display device includes a carrier, a substrate unit, a plurality of light emitting elements and a circuit unit. The carrier has a top surface and a bottom surface opposite to each other, and a peripheral surface interconnecting the top and bottom surfaces. The substrate unit is disposed on one side of the peripheral surface of the carrier. The light emitting elements are spacedly disposed on the top surface of the carrier. The circuit unit includes a plurality of circuit modules that are disposed on the substrate unit and that are electrically connected to the light emitting elements. Each of the circuit modules includes a switch control circuit and a driving circuit that are configured to control the light emitting elements.

Growing community of inventors

Hsinchu, Taiwan

Yi-Sheng Lin