Everlight Electronics Co., Ltd.

Yi-Sheng Lan

Chung-Chuan Hsieh

Chieh-Yu Kang

Hao-Yu Yang

Ke-Hao Pan

Sheng-Wei Chou

Tzu-Lun Tseng

Chia-Fong Chou

Jen-Hao Pan

The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

LED package structure and method for manufacturing same

Growing community of inventors

Taipei, Taiwan

Yi-Sheng Lan