Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Yi Qin

Mark Lefebvre

Julia Woertink

Zuhra I Niazimbetova

Erik Reddington

Matthew A Thorseth

Joanna Dziewiszek

Kristen Flajslik

Yu Luo

Julia Kozhukh

Wan Zhang-Beglinger

Elissei Iagodkine

Margit Clauss

Adolphe Foyet

Jonathan D Prange

Inho Lee

Pedro O Lopez Montesinos

Masaaki Imanari

Niazimbetova Zuhra

Indium electroplating compositions containing amine compounds in trace amounts to electroplate substantially defect-free uniform indium which has a smooth surface morphology. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.

Indium electroplating compositions containing amine compounds and methods of electroplating indium

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of &#x3b1;-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

Iridium electroplating compositions containing 1,10-phenanthroline compounds in trace amounts to electroplate substantially defect-free uniform and smooth surface morphology indium on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.

Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium

Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Electroplating baths of silver and tin alloys

Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity.

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Westborough, MA, United States of America

Yi Qin