Inventec Corp.

Inventec (pudong) Technology Corporation

Yi-Lun Cheng

Chih-Kai Yang

Feng-Ku Wang

Chun-Lung Lin

Ming-Hung Lin

Frank Tinghwa Wang

Chun-Yi Chang

Jui-Chan Fan

Wei-Yi Lin

Chih Kai Yang

Meng-Lung Chiang

Kuo-Chi Ting

Hua-Feng Chen

Po-Hsuan Chen

Chih-Ming Weng

Wei-Hsin Wu

Cheng-Shi Liu

An air cooling system for electronic devices includes a body, a thermal conduction component, and a heat dissipation fan. The body has a heat dissipation port and air inlet ports. The air inlet ports are disposed at a first housing part and a second housing part of the body. The first housing part is opposite to the second housing part. The thermal conduction component is disposed in the body and configured to contact a heat source. The heat dissipation fan is disposed in the body. The heat dissipation fan includes a first axial air inlet opening, a second axial air inlet opening, and radial air outlet openings. The first axial air inlet opening corresponds to one of the air inlet ports of the first housing part. The second axial air inlet opening corresponds to one of the air inlet ports of the second housing part.

Air cooling system

A heat dissipating system for electronic devices includes a first heat dissipation device, a second heat dissipation device, and a thermal conduction component. The thermal conduction component is disposed around the first heat dissipation device and configured to thermally contact a heat source. The second heat dissipation device is disposed adjacent to the thermal conduction component. The first heat dissipation device is configured to generate a first working fluid toward the thermal conduction component, such that the heat transferred from the heat source to the thermal conduction component is dispersed in a plurality of directions directing away from the first heat dissipation device. The second heat dissipation device is configured to generate a second working fluid, such that the heat distributed adjacent to the second heat dissipation device is dissipated in at least one direction directing away from the second heat dissipation device.

Heat dissipating system

A heat pipe structure is used for cooling a heat source. The heat pipe structure includes a sleeve tube and a shaft. The sleeve tube includes an inner wall. The sleeve tube has a trench on the inner wall. The trench is at an outlet end of the sleeve tube. The trench extends in a circumferential direction of the sleeve tube. The shaft is connected to the heat source. The shaft is inserted into the sleeve tube from the outlet end such that the shaft is rotatable relative to the sleeve tube. The trench surrounds the shaft.

Heat pipe structure

A cooling fan includes a base, a tube, a bearing, a stator, a rotor, and fan blades. The base includes a base protrusion. Each of the fan blades includes a first notch. When the cooling fan is working, the base protrusion passes through the first notch on each of the fan blades. The base protrusion and the first notch not only increase the heat exchange area of the base but break the thermal boundary layer on the base repeatedly to improve the heat dissipating effect when the cooling fan is working.

Cooling fan and heat dissipating module including the same

A heat dissipation assembly and portable electronic device including the same wherein heat dissipation assembly includes first heat pipe. The first heat pipe includes first end part and second end part that are opposite to each other. The second end part includes inner peripheral wall and outer peripheral wall surrounding the inner peripheral wall. A vapor channel is formed between the outer peripheral wall and the inner peripheral wall. The inner peripheral wall forms insertion hole. A central line of the insertion hole is at first distance from the outer peripheral wall along first direction. The central line of the insertion hole is at second distance from the outer peripheral wall along second direction. The first direction is different from the second direction, and the first distance is different from the second distance.

Heat dissipation assembly and portable electronic device

A noise cancellation device includes a voice receiving module, a distance measuring module, a noise cancellation module and a speaker module. The voice receiving module is configured to receive a noise. The distance measuring module is configured to send a distance measuring signal to an object, and calculate distance information of the object according to a reflected distance measuring signal reflected by the object. The noise cancellation module is connected to the voice receiving module and the distance measuring module, and is configured to generate a reverse phase signal of the noise according to the noise. The speaker module is connected to the noise cancellation module, and is configured to generate an anti-noise according the reverse phase signal, and sound the anti-noise according to the distance information.

Noise cancellation device and noise cancellation method

A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.

Method for forming a case for an electronic device and manufactured case structure for electronic device

Electronic apparatus includes a display component, a base, a moveable case, and a transmission component. The display component includes a rotational shaft. The base is pivotally connected to the rotational shaft. The base has an opening. The moveable case is pivotally connected to the base. The moveable case can selectively cover or uncover the opening. The transmission component is disposed on the base. The transmission component is operatively connected between the rotational shaft and the moveable case. When the display component is rotated away from the base, the rotational shaft actuates the moveable case to rotate to uncover the opening through the transmission component. When the display component is rotated toward the base, the rotational shaft actuates the moveable case to rotate to cover the opening through the transmission component.

Electronic apparatus

Portable electronic apparatus includes a display component, a base, a keyboard component, and a slidable structure. The display component includes an interlocking structure. The base includes a pivotally-connected portion, pivotally-connected to the display component. The keyboard component disposed on the base can move toward or away from the base. The slidable structure disposed between the base and the keyboard component can slide relative to the base. The slidable structure includes a protruding portion, protruding along a side of the slidable structure away from the base. While the display component is rotated away from the base, the interlocking structure of the display component is actuated by the rotated display component, and drive the slidable structure to slide away from the pivotally-connected portion, moved relative to the base. Subsequently, the first protruding portion of the slidable structure pushes the keyboard component moving away from the base.

Portable electronic apparatus

A heat dissipation module includes an electro-magnetic member, an elastic member and a magnetic member. The electro-magnetic member is configured for generating a periodic magnetic field. The elastic member includes a fixed end, a free end and multiple blades for expanding or closing; and the blades are located between the fixed end and the free end. The magnetic member is disposed on the free end and configured for reciprocating due to being magnetically induced by the periodic magnetic field so as to drive the plurality of blades to produce an air current.

Heat dissipation module

A fan blade structure includes a hub, an annular partition surrounding the hub, a first blade group and a second blade group. The hub has a top surface and a flank connected to the top surface. The first blade group, disposed on one side of the annular partition, includes two blade arrays having multiple first and second blades respectively. The clearance between the two adjacent first blades is less than that between the two adjacent second blades. The second blade group, disposed on another side of the annular partition, includes another two blade arrays having a plurality of third and fourth blades respectively. The clearance between the two adjacent third blades is less than that between the two fourth blades adjacent to each other.

Fan blade structure

An electronic device comprises a casing, a heat generation source, an airflow guiding structure, and a jet flow generator. The casing includes an interior space. The airflow guiding structure is in contact with the heat generation source and has one air inlet. The jet flow generator, the heat generation source, and the airflow guiding structure together are situated within the interior space. The jet flow generator includes a nozzle which directs toward the air inlet of the airflow guiding structure at a distance apart. Airflows emitted by the jet flow generator through the nozzle travel at a velocity greater than 0.1 meters/second (m/s), causing a fluid pressure differential with the neighboring air and pulling air in the vicinity along the air inlet into the airflow guiding structure.

Electronic device including a jet flow generator

An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet.

Electronic device

An electronic device includes a case, a heat source, a radiator, and an air stream generator. The case has an air ventilation hole and an opening. The radiator is disposed in the case and in thermal contact with the heat source. The radiator includes a main body having a first, a second, and a third side surface. A first air inlet, an air outlet, and a second air inlet are disposed on the first side surface, the second side surface, and the third side surface, respectively. The third side surface and the case are separated by a distance from each other. The second air inlet is disposed between a geometric middle plane of fins of the main body and the second side surface. The distance between the second air inlet and the first side surface is greater than that between the air ventilation hole and the first side surface.

An electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source. The heat dissipation device includes a casing having a heat dissipation material including 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The casing has a surface facing the heat source. A central area and an outer ring area are defined on the surface. A geometric midpoint of the central area overlaps a geometric midpoint of the surface. An orthographic projection region of the heat source to the surface is located in the central area. The heat dissipation device absorbs heat generated by the heat source through thermal radiation.

Growing community of inventors

Taipei, Taiwan

Yi-Lun Cheng