Siliconware Precision Industries Co., Ltd.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Largan Medical Co., Ltd.

Yi-Ling Chen

Chun-Hung Teng

Wei-Yuan Chen

Kuan-Wei Chuang

Tzu-Rong Lu

An electronic package and a manufacturing method thereof are provided, where the manufacturing method is to dispose an electronic structure with a plurality of conductive bumps and a thermal conductor on its upper surface on a carrier structure via external bumps on its lower surface, so that when reflowing the external bumps, the heat of the heat source joint is conducted from the upper surface of the electronic structure to the external bumps on the lower surface via the thermal conductor, so as to facilitate the heating and reflowing of the external bumps to avoid the problem of non-wetting of the solder.

Electronic structure having first and second thermal conductive materials covering conductive bumps and manufacturing method thereof, and electronic package having electronic structure and manufacturing method thereof

An electronic structure is provided, in which a plurality of conductors are disposed on one surface of an electronic body, an epoxy molding compound is used as a protective layer to encapsulate the plurality of conductors, a circuit portion is bonded onto the other surface of the electronic body, and a plurality of external bumps and solder material are formed on the circuit portion. Therefore, with the design of the protective layer, heat energy can be effectively transferred from the protective layer to the solder material below during a process of heating the electronic structure so as to avoid a problem of non-wetting of the solder material.

Electronic package, electronic structure and manufacturing method thereof

A plasticizer, which is biodegradable, has a molecule including a central structure, at least two connecting structures and at least one side-chain structure. The central structure includes at least one of a benzene derivative and at least one amino acid. The connecting structures are respectively connected to the central structure, wherein the connecting structures include a first connecting structure and a second connecting structure. The first connecting structure is an amine group, and the second connecting structure is a carboxyl group. The side-chain structure is a chain of multiple carbon atoms, and the side-chain structure is connected to at least one of the first connecting structure and the second connecting structure. An amide bond is formed as the side-chain structure connected to the amine group, and an ester bond is formed as the side-chain structure connected to the carboxyl group.

Plasticizer and plastic product

A method for in situ monitoring of particles generated by a reaction by-product film peeling from an interior wall of a reaction chamber of a semiconductor fabrication apparatus to determine reaction chamber condition. The method includes the steps of: exciting the particles to emit light; and comparing an intensity value of the light, measured at a selected time during a predetermined time period, to a predetermined light intensity threshold value. If the intensity value of the light measured at the selected time is above the predetermined light intensity threshold value, the chamber condition is abnormal. If the intensity value of the light is equal to or below the predetermined light intensity threshold value, the chamber condition is normal.

Growing community of inventors

Taichung, Taiwan

Yi-Ling Chen