Kinpo Electronics, Inc.

Cal-comp Electronics & Communications Company Limited

Xyzprinting, Inc.

Yi-Lin Chiu

Yang-Teh Lee

Shih-Jer Din

A wire fusing apparatus including a first body having a first surface, a second body having a second surface, and a heating unit is provided. The second body is pivoted to the first body to rotate relatively to the first body enabling the first and second bodies to be in an expanded or a closed state. When the first and second bodies are in the closed state, the first and second surfaces define a closed containing groove for containing two independent wires butt jointed with each other. The first surface, the second surface and the containing groove each has a heat-conducting region, and the heat-conducting regions contact each other when the first and second bodies are in the closed state. The heating unit disposed on the first or second body contacts one of the heat-conducting regions for heat-fusing a butt-jointing point of the wires to form a fused wire.

Growing community of inventors

Taipei, Taiwan

Yi-Lin Chiu