Intel Corporation

Georgia Tech Research Corporation

Yi Li

Tao Wu

Mihir K Roy

Wei-Lun Kane Jen

Manohar S Konchady

Wei Wu

Kyu Oh Lee

Gang Duan

Nicholas S Haehn

Yueli Liu

Yosuke Kanaoka

Arnab Roy

Ching Ping Wong

Wei Li

Minglu Liu

Robin Mcree

Raquel De Souza Borges Ferreira

Hong Seung Yeon

Ed Prack

Kyoung-sik Moon

A method for recognizing a reference point associated with a fiducial marker including the steps of: obtaining or receiving image data of the fiducial marker; determining the degree of which the image data of the fiducial marker is aligned with one or more reference images; of which if the degree of alignment is determined to be less than an acceptable threshold predicting a set of coordinates of the reference point associated with the fiducial marker; incorporating the set of coordinates with the image data to form a modified image data; and determining the degree of which the modified image data of the fiducial marker is aligned with one or more reference images.

Device and method for improved fiducial marker detection

A coreless package substrate with dual side solder resist layers is disclosed. The coreless package substrate has a top side and a bottom side opposite of the top side and includes a single build-up structure formed of at least one insulating layer, at least one via, and at least one conductive layer. The coreless package substrate also includes a bottom plurality of contact pads on the bottom side, and a top plurality of contact pads on the top side. A bottom solder resist layer is on the bottom side, and a top solder resist layer is on the top side. The concept of dual side solder resist is extended to packages with interconnect bridge with C4 interconnection pitch over a wide range.

Methods of forming a package substrate

Embodiments are generally directed to indium solder metallurgy to control electro-migration. An embodiment of an electronic device includes a die; and a package substrate, wherein the die is bonded to the package substrate by an interconnection. The interconnection includes multiple interconnects, and wherein the interconnection includes a solder. The solder for the interconnection includes a combination of tin (Sn), copper (Cu), and indium (In).

Indium solder metallurgy to control electro-migration

Solder resist layers for coreless packages and methods of fabrication

Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication

In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.

Polymer thermal interface materials

Modified electrically conductive adhesives and methods of preparation thereof, are disclosed.

Electrically conductive adhesives and methods of making

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Chandler, AZ, United States of America

Yi Li