Maother (Suzhou) Home Appliance Technology Co., Ltd.

Fairchild Semiconductor Corporation

Lesorocity (Shenzhen) Industrial Co., Ltd.

Maother (Suzhou) Electric Equipment Co., Ltd.

Mama Mao (Suzhou) Electrical Technology Co., Ltd.

Yi Li

Jing Zhang

Zhengyu Zhu

FangFang Yang

Weiming Song

Vacuum cleaner

A negative pressure pneumatic hair clipper includes a housing and a hair cutting bit mounted on the head of the housing; a negative pressure turbine airway and a suction airway isolated from each other go all the way through the housing; a negative pressure turbine wind motor connected with the hair cutting bit is provided inside the negative pressure turbine airway and, when rotated, can drive the hair cutting bit to perform the hair cutting operation; a suction mouth of the suction airway is disposed near the hair cutting bit; the tail of the housing is connected with an airway hose that is in gas phase communication with the negative pressure turbine airway and the suction airway, with the other end of the airway hose connected with a vacuum cleaner capable of generating negative pressure airflow to drive the negative pressure turbine wind motor to rotate.

Negative pressure pneumtic hair clipper

Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using a boundary feature(s) containing a bond wire to define a perimeter on the die attach pad, depositing a conductive material (such as solder) within the perimeter, and then attaching a die containing an integrated circuit device to the die attach pad by using the conductive material. The boundary feature(s) allow an increased thickness of conductive material to be used, resulting in increased bond line thickness and increasing the durability and performance of the resulting semiconductor package. Other embodiments are described.

High bond line thickness for semiconductor devices

Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using boundary features to define a perimeter on the die pad, depositing a conductive material (such as solder) within the perimeter, and then bonding a die containing an integrated circuit to the die pad by using the conductive material. The boundary features allow an increased thickness of conductive material to be used, resulting in an increased bond line thickness and increasing the durability and performance of the resulting semiconductor device.

Growing community of inventors

Suzhou, China

Yi Li