Applied Materials, Inc.

Yi Kun Kelvin Goh

Eric J Bergman

John Leonard Sudijono

James S Papanu

Arvind Sundarrajan

Guan Huei See

Prayudi Lianto

Vicknesh Sahmuganathan

Yin Wei Lim

Wei Ying Doreen Yong

Nur Yasmeen Addina Mohamed Helmi Isik

Methods and apparatus for processing a substrate are provided herein. For example, methods for enhancing surface hydrophilicity on a substrate comprise a) supplying, using a remote plasma source, water vapor plasma to a processing volume of a plasma processing chamber to treat a bonding surface of the substrate, b) supplying at least one of microwave power or RF power at a frequency from about 1 kHz to 10 GHz and a power from about 1 kW to 10 kW to the plasma processing chamber to maintain the water vapor plasma within the processing volume during operation, and c) continuing a) and b) until the bonding surface of the substrate has a hydrophilic contact angle of less than 10°.

Water vapor plasma to enhance surface hydrophilicity

Growing community of inventors

Singapore, Singapore

Yi Kun Kelvin Goh