Taiwan Semiconductor Manufacturing Comp. Ltd.

Yi-Jie Chen

Keng-Ying Liao

Yi-Hung Chen

Po-Zen Chen

Ru-Gun Liu

Ying-Chou Cheng

Feng-Yuan Chiu

Chun-Yu Lin

Chung-Bin Tseng

Tsai-Sheng Gau

Kuei-Liang Lu

Ya-Hui Chang

I-Chang Shih

Bing-Syun Yeh

Shih-Ming Chang

Shih-Hsun Hsu

Chia-Cheng Chang

Yi-Fang Yang

Chiu Hsiu Chen

Chun-Chi Lee

The present disclosure provides a method of fabricating a semiconductor structure, and the method includes following steps. A gate structure is formed on a substrate, and a liner layer is formed to cover the gate structure and the substrate. A spacer layer is formed on the liner layer, and an etching gas is continuously provided to remove a portion of the spacer layer while maintaining the substrate at a second pressure, which the etching gas has a first pressure. The second pressure is greater than the first pressure.

Method of fabricating semiconductor structure

A method for forming a semiconductor device structure is provided. The semiconductor device structure includes forming a film over a substrate. The semiconductor device structure includes forming a first mask layer over the film. The semiconductor device structure includes forming a second mask layer over the first mask layer. The second mask layer exposes a first portion of the first mask layer. The semiconductor device structure includes performing a plasma etching and deposition process to remove the first portion of the first mask layer and to form a protection layer over a first sidewall of the second mask layer. The first mask layer exposes a second portion of the film after the plasma etching and deposition process. The semiconductor device structure includes removing the second portion using the first mask layer and the second mask layer as an etching mask.

Method for forming semiconductor device structure

A semiconductor device includes a substrate, a conductive layer, a transparent layer, a transparent hard mask layer, a carrier, and a device layer. The substrate has a first surface and a second surface opposite to each other. The conductive layer is disposed on the first surface of the substrate. The transparent layer is disposed on the conductive layer. The transparent hard mask layer is disposed on the transparent layer, in which the substrate has an etch selectivity with respect to the transparent hard mask layer. The device layer is disposed between the carrier and the second surface of the substrate, in which various portions of the device layer are respectively exposed by various through holes which pass through the transparent hard mask layer, the transparent layer, the conductive layer, and the substrate.

Method for manufacturing CMOS image sensor

A photomask and method for fabricating an integrated circuit is provided. A design layout is provided, wherein the design layout has a plurality of main features. A plurality of assistant features are added in an assistant region of the design layout to form a first layout, wherein the assistant region has no main feature and a width of the assistant region is larger than five times of a width of the main feature. A plurality of optical proximity correction (OPC) features are added on the first layout to form a second layout. And a photomask is formed according to the second layout.

Photomask and method for fabricating integrated circuit

A photomask and method for fabricating an integrated circuit is provided. The photomask includes a plurality of main features, enclosed in at least one first region and at least one second region, wherein the first region comprises single the main feature and the second region comprises multiple the main features; and a plurality of assistant features disposed between the first region and the second region, or between the second regions. The photomask enhances the accuracy of the critical dimension and facilitate fabricating an integrated circuit.

According to an exemplary embodiment, a method of forming a substrate pattern having an isolated region and a dense region is provided. The method includes the following operations: forming a first photoresist layer over the substrate; exposing the first photoresist layer through a first mask corresponding to the isolated region; developing the first photoresist layer to form a first pattern; forming a second photoresist layer over the substrate and the first pattern; exposing the second photoresist layer through a second mask corresponding to the substrate pattern; developing the second photoresist layer to form a second pattern; and etching the first pattern and the substrate to form the substrate pattern in the isolated region and the dense region.

Method of forming substrate pattern

A method for characterizing a three-dimensional surface profile of a semiconductor workpiece is provided. In this method, the three-dimensional surface profile is imaged from a normal angle to measure widths of various surfaces in a first image. The three-dimensional surface is also imaged from a first oblique angle to re-measure the widths of the various surfaces in a second image. Based on differences in widths of corresponding surfaces for first and second images, a feature height and sidewall angle are determined for the three-dimensional profile.

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Tainan, Taiwan

Yi-Jie Chen