Apple Inc.

Yi Jiang

Mattia Pascolini

Siwen Yong

Lijun Zhang

Jiangfeng Wu

Ruben Caballero

Robert W Schlub

Qingxiang Li

Matthew A Mow

Yuehui Ouyang

Basim H Noori

Rodney Andres Gomez Angulo

Enrique Ayala Vazquez

Carlo Di Nallo

Jayesh Nath

Mario Martinis

Eduardo Jorge Da Costa Bras Lima

Zheyu Wang

Fletcher R Rothkopf

Trevor J Ness

Rex Tyler Ehman

James G Horiuchi

Gordon Michael Coutts

Samuel A Resnick

Simon G Begashaw

Erik G De Jong

Mohit Narang

Jiang Zhu

Anthony Sagala Montevirgen

Indranil S Sen

Omar Sze Leung

David T Amm

Hao Xu

Jason C Sauers

Brian Michael King

Makiko K Brzezinski

Lu Zhang

Xu Han

Boon Wai Shiu

Khan M Salam

Bing Jiang

Emily McMilin

Adam Duckworth Mittleman

Bing Chiang

James R Wilson

Harish Rajagopalan

Gregory Allen Springer

Martin Melcher

Liang Han

Kyle H Yeates

Douglas Blake Kough

Wey-Jiun Lin

Phil M Hobson

Salih Yarga

Thomas E Biedka

Liquan Tan

Blake R Marshall

Reza Nasiri Mahalati

Brian Lynch

Stephen Robert McClure

Madhusudan Chaudhary

Sean S Corbin

Jerzy S Guterman

Hongfei Hu

Steven P Cardinali

Ming-Ju Tsai

Vaneet Pathak

Erdinc Irci

Miroslav Samardzija

Ivan S Maric

Jouya Jadidian

Michael D Quinones

Huan-Chu Huang

Umar Azad

Digvijay Arjunrao Jadhav

Taylor Harrison Gilbert

Mushtaq A Sarwar

Eduardo Lopez Camacho

Amin Tayebi

Scott D Morrison

Aaron J Cooper

Siddharth Nangia

Chun-Lung Chen

Kexin Ma

Jiaxiao Niu

Martin Schauer

Mark D Neumann

Conor P Lenahan

Ana Papio Toda

Javier Gomez Tagle

Evan D Christensen

Matthew Fong

Thomas W Yang

Brian D Mariner

Francesco Merli

Li-jun Zhang

Hee-Joung Joun

Per Jakob Helander

Johan Avendal

A head-mounted device may have a head-mounted housing. The housing may include a frame with left and right openings that receive respective left and right optical modules that present images to a user's eyes. Each optical module may have a lens and display that presents an image through the lens. Camera support members may be coupled to respective left and right peripheral portions of the frame. Each camera support member may have openings configured to receive cameras. Antennas may be formed on a camera support member. The antennas may have metal traces on a surface of the camera support member, may have conductive structures embedded within the camera support member, and/or may have patterned metal traces on printed circuits attached to or embedded in the camera support member. The cameras may operate through portions of a display cover layer that covers an outwardly-facing display on the head-mounted housing.

Electronic devices with antennas and optical components

An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.

Electronic devices having multilayer millimeter wave antennas

An electronic device may be provided with wireless communications circuitry and control circuitry. The wireless communications circuitry may include centimeter and millimeter wave transceiver circuitry and a phased antenna array. A dielectric cover may be formed over the phased antenna array. The phased antenna array may transmit and receive wireless radio-frequency signals through the dielectric cover. The dielectric cover may have first and second opposing surfaces. The second surface may face the phased antenna array and may have a curvature. The curvature of the second surface may include one or more recessed regions of the dielectric cover. The one or more recessed regions of the second surface may serve to maximize and broaden the coverage area for the phased antenna array. The first surface may be conformal to other structures in the electronic device.

Dielectric covers for antennas

An electronic device may have a cover layer and an antenna. A dielectric adapter may have a first surface coupled to the antenna and a second surface pressed against the cover layer. The cover layer may have a three-dimensional curvature. The second surface may have a curvature that matches the curvature of the cover layer. Biasing structures may exert a biasing force that presses the antenna against the dielectric adapter and that presses the dielectric adapter against the cover layer. The biasing force may be oriented in a direction normal to the cover layer at each point across dielectric adapter. This may serve to ensure that a uniform and reliable impedance transition is provided between the antenna and free space through the cover layer over time, thereby maximizing the efficiency of the antenna.

Electronic devices having antennas that radiate through three-dimensionally curved cover layers

A head-mounted device may have a head-mounted housing. The head-mounted housing may have rear-facing displays that display images for a user. The images are viewable from eye boxes while the head-mounted device is being worn by the user. A peripheral conductive member may run along a peripheral edge of the front face of the housing. Dielectric-filled gaps may divide the peripheral conductive member into elongated conductive segments. The conductive segments may form antenna resonating elements for antennas on the front face. Radio-frequency transceiver circuitry such as cellular telephone transceiver circuitry may be coupled to the antennas.

Systems with wireless communications

An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.

Electronic devices having millimeter wave and ultra-wideband antenna modules

An electronic device may be provided with a phased antenna array on an antenna module. The array may include low band antennas and high band antennas that radiate at frequencies greater than 10 GHz. The module may include antenna layers, transmission line layers, and ground traces that separate the antenna layers from the transmission line layers. The low band antennas and the high band antennas may have radiators patterned onto the antenna layers. The radiators may be fed by transmission lines on the transmission line layers. The antenna layers may have a dielectric permittivity that is greater than the dielectric permittivity of the transmission line layers. This may serve to reduce the lateral footprint of the low band and high band antennas, which allows the antennas to be interleaved along a common linear axis in the phased antenna array, thereby minimizing the lateral footprint of the antenna module.

Radio-frequency modules having high-permittivity antenna layers

An electronic device may include a curved cover layer and an antenna. The antenna may include a ground and a resonating element on a curved surface of a substrate. The curved surface may have a curvature that matches that of the cover layer. The resonating element may include first, second, and third arms fed by a feed. The first arm and a portion of the ground may form a loop antenna resonating element. The second arm and the first arm may form an inverted-F antenna resonating element, where a portion of the first arm forms a return path to the antenna ground for the inverted-F antenna resonating element. A gap between the first and second arms may form a distributed capacitance. The third arm may form an L-shaped antenna resonating element. The antenna may have a wide bandwidth from below 2.4 GHz to greater than 9.0 GHz.

Electronic devices having wideband antennas

A wireless communication system comprises a base station and one or more relay docks and transmits directional wave signals between components using high frequency waves, such as millimeter waves. A beam forming decision engine utilizes position information collected from one or more position or motion sensors of a user device to determine a direction in which to form a directional wave signal being transmitted between components of the wireless communication system.

Relay dock and base station with position information based directional wave forming

An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include millimeter wave antenna arrays. Non-millimeter-wave antennas such as cellular telephone antennas may have conductive structures separated by a dielectric gap. In a device with a metal housing, a plastic-filled slot may form the dielectric gap. The conductive structures may be slot antenna structures, inverted-F antenna structures such as an inverted-F antenna resonating element and a ground, or other antenna structures. The plastic-filled slot may serve as a millimeter wave antenna window. A millimeter wave antenna array may be mounted in alignment with the millimeter wave antenna window to transmit and receive signals through the window. Millimeter wave antenna windows may also be formed from air-filled openings in a metal housing such as audio port openings.

Electronic devices with millimeter wave antennas and metal housings

An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.

Electronic devices having antennas with hybrid substrates

An electronic device may have an antenna that conveys radio-frequency signals at frequencies greater than 10 GHz. The antenna may be embedded in a substrate. The substrate may have routing layers, first antenna layers on the routing layers, second antenna layers on the first antenna layers, and a third antenna layers on the second antenna layers. The antenna may include first traces on the first antenna layers, second traces on the second antenna layers, and third traces on the third antenna layers. The first antenna layers may have a first bulk dielectric permittivity. The second layers may have a second bulk dielectric permittivity. The third layers may have a third bulk dielectric permittivity. At least one of the first, second, and third bulk dielectric permittivities may be different from the others. This may differentially load the antenna across the antenna layers, thereby broadening the bandwidth of the antenna.

Electronic devices having differentially-loaded millimeter wave antennas

An electronic device may include first and second phased antenna arrays that convey radio-frequency signals at frequencies greater than 10 GHz. The second array may have fewer antennas than the first array. Control circuitry may control the first and second arrays in a diversity mode and in a simultaneous array mode. In the diversity mode, the first array may form a first signal beam while the second array is inactive. When the first array is blocked by an object or otherwise exhibits unsatisfactory performance, the second array may form a second signal beam while the first array is inactive. In the simultaneous mode, the first and second arrays may form a combined array that produces a third signal beam. The combined array may maximize gain. Hierarchical beam searching operations may be performed. The arrays may be distributed across one or more modules.

Electronic devices having multiple phased antenna arrays

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Cupertino, CA, United States of America

Yi Jiang