Innolux Corporation

Yi-Hung Lin

Chin-Lung Ting

I-Yin Li

Tang-Chin Hung

Cheng-Chi Wang

Chia-Chi Ho

Yeong-E Chen

Li-Wei Sung

Hsueh-Hsuan Chou

Chung-Kuang Wei

Kung-Chen Kuo

Nai-Fang Hsu

Cheng-En Cheng

Yu-Ti Huang

Yu-Hsiang Chiu

Hsiu-Yi Tsai

Ker-Yih Kao

Hui-Min Huang

Yu-Ting Liu

Chia-Chieh Fan

Chung-Le Chen

Wen-Hsiang Liao

Shuo-Ting Hong

Kuan-Jen Wang

Jeng-Nan Lin

Fuh-Tsang Wu

Kuang-Chiang Huang

Chun-Hung Lai

Hsia-Ching Chu

Yu-Chia Huang

Kazuyuki Hashimoto

Jen-Hai Chi

Yan-Zheng Wu

Peng-Cheng Huang

Hung-I Tseng

Chen-Lin Yeh

Huei-Ying Chen

Ming-Yen Weng

Chuan-Ming Yeh

Yi-Ling Yu

Wei-Ching Cho

Po-Syun Chen

Ching-Wei Chen

Cheng-I Wu

Chun-Chin Fan

Yi-Chen Chou

Charlene Su

Kuo-Chun Lo

Chien-Chang Lu

Chih-Chi Chen

Cheng-Hung Tsai

The disclosure provides an adjusting device having an active region and a peripheral region adjacent to the active region. The adjusting device includes a first substrate, a first conducting layer, a first insulating layer, a second conducting layer, a second insulating layer, and a sealant layer. The first insulating layer is disposed on the first conducting layer and includes a first opening disposed in the peripheral region. The second conducting layer is disposed on the first conducting layer and electrically connected to the first conducting layer through the first opening. The second insulating layer includes multiple first protruding structures disposed in the peripheral region and on the first insulating layer. The sealant layer is disposed in the peripheral region and on the second insulating layer. The first opening is disposed between two of the first protruding structures.

Adjusting device

An electronic device and a method for manufacturing the same are provided. The electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; and a second insulating layer disposed on the first metal bump, wherein the second insulating layer includes a first opening exposing a portion of the first metal bump, wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.

Electronic device with improved electricial property

Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

Electronic device

A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and the first isolation layer.

Package device

A modulation device including a plurality of electronic elements, at least one first signal line and a first driving circuit is provided. The at least one first signal line is respectively electrically connected to at least one of the electronic elements. The first driving circuit is electrically connected to the at least one first signal line. The first driving circuit provides a first signal to at least one of the at least one first signal line. The first signal includes a first pulse. The first pulse includes a first section and a second section closely adjacent to the first section.

Modulation device

Disclosed is an electronic device including a tunable element, a first power supply circuit, and a second power supply circuit. The first power supply circuit and the second power supply circuit are electrically connected to the tunable element. The first power supply circuit drives the tunable element during a first time period. The second power supply circuit drives the tunable element during a second time period.

A modulating device is provided. The modulating device includes multiple modulating elements, multiple pixel circuits, and a compensation circuit. The pixel circuits are electrically connected to the modulating elements correspondingly. The compensation circuit includes a driving unit, a voltage source, and a current source. The driving unit provides a driving signal to the pixel circuits. The voltage source is electrically connected to the driving unit. The voltage source provides a constant voltage to the pixel circuits. The current source is electrically connected to the driving unit. The current source provides a constant current to the pixel circuits.

Modulating device

The disclosure provides an electrical apparatus, including a substrate, a plurality of gate driver units and a plurality of gate lines. The gate driver units are disposed on the substrate. The gate lines are disposed on the substrate. Each of the gate lines is respectively electrically connected to the corresponding gate driver unit. Each of the gate lines is configured to transmit a respective gate signal. The gate lines include a first gate line and a second gate line. The first gate line and the second gate line are configured to transmit the respective gate signals at a same time.

Electrical apparatus

The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.

An electronic component and a manufacturing method thereof are provided. The electronic component includes a structure member and a connecting member. The structure member includes at least one working unit. The at least one working unit is disposed in a first region. The connecting member is disposed on the structure member and includes a second region. The second region is overlapped with the first region, and a metal density of the second region is less than a metal density of the first region. The electronic component and the manufacturing method thereof of the embodiment of the disclosure include the effect of improving the reliability or quality of the electronic component.

Electronic component and manufacturing method thereof

A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.

Manufacturing method of package structure

An electronic device with short frame time length is provided. The electronic device includes a substrate, a plurality of first signal lines, a plurality of second signal lines, and two first integrated circuits. The plurality of first signal lines are disposed on the substrate. The plurality of first signal lines are divided into a first group of signal lines and a second group of signal lines. The plurality of second signal lines are disposed on the substrate. The plurality of second signal lines are disposed alternately with the plurality of first signal lines. The two first integrated circuits are bonded on the substrate. Each of the two first integrated circuits are electrically connected to the first group of signal lines and the second group of signal lines. The first group of signal lines and the second group of signal lines are disposed alternately in columns.

Electronic device and modulating device with short frame time length

An electronic device is provided. The electronic device includes a substrate, a conductive layer, an insulating layer, and a modulating material. The conductive layer is disposed on the substrate and has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. The modulating material is disposed on the insulating layer.

Growing community of inventors

Miao-Li County, Taiwan

Yi-Hung Lin