Siemens Aktiengesellschaft

Yangtze Memory Technologies Co., Ltd.

Yi Hua Liu

Yue Hua Zhang

Qi Wang

Ming Yu

Zhou Yuan

Jun Liu

Lu Ming Fan

Provided in an embodiment of the present disclosure is a method for acquiring data of a data source associated with a production line, including: acquiring a semantic model, the semantic model including semantic relationships between respective semantic units and data source identifiers corresponding to one or more production lines; receiving production line identifiers and acquiring one or more semantic units; converting, based upon the semantic model, the one or more semantic units to data source identifiers corresponding to production lines indicated by the production line identifiers; and acquiring data of data sources indicated by the data source identifiers. Implementing the embodiments disclosed in the present disclosure simplifies a configuration file required for a virtual model of a production line, thereby greatly reducing configuration workload, and enhancing convenience of acquiring data of a data source.

Method and device for acquiring data of data sources associated with production line

A data analysis method, device and system are disclosed. In an embodiment, the method includes performing data analysis on the devices by an application by collecting at least one key performance indicator of the devices, estimating the performance of the application according to the result of the data analysis, generating an application upgrade requirement on the basis of the performance estimation result, and sending the upgrade requirement to an industrial cloud; receiving a context data requirement generated by the industrial cloud based upon of the upgrade requirement, collecting context data from the devices according to the context data requirement, and returning the context data to the industrial cloud; and downloading from the industrial cloud the application updated on the basis of the context data. The data analysis mechanism reduces the development process of custom and special applications by automatically upgrading to adapt to changes in field application conditions.

Data analysis method, device and system

Embodiments of three-dimensional (3D) memory devices having source contact structure in a memory stack are disclosed. The 3D memory device has a memory stack that includes a plurality of interleaved conductor layers and insulating layers extending over a substrate, a plurality of channel structures each extending vertically through the memory stack into the substrate, and a source contact structure extending vertically through the memory stack and extending laterally to separate the memory stack into a first portion and a second portion. The source contact structure may include a plurality of source contacts each electrically coupled to a common source of the plurality of channel structures.

Source contact structure of three-dimensional memory devices and fabrication methods thereof

Growing community of inventors

Wuhan, China

Yi Hua Liu