Siliconware Precision Industries Co., Ltd.

Yi-Hsuan Liu

Ying-Chou Tsai

Shao-Tzu Tang

Jia-Fong Yeh

Mei-Chi Chen

A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.

Growing community of inventors

Taichung, Taiwan

Yi-Hsuan Liu