Inventec Corp.

Lite-on Technology Corporation

Compal Electronics, Inc.

Lite-on Opto Technology (changzhou) Co., Ltd.

Tsinghua University

Yi-Hsuan Chen

Po-Jui Chen

Chen-Cheng Wang

Sheng-Hung Lee

Yen-Hua Hsiao

Chen-Hsiu Lin

Shih-Chang Hsu

Chun-Ying Yang

Yu-Yu Chang

Ming-Hung Shih

Chi-Young Lee

Shih-Chiang Yen

Hsin-Tien Chiu

Min-Chiao Tsai

Kuei-Lin Chan

Ting-Kai Chen

Chin-Yuan Li

Chih-Han Kuo

Chi-Hua Yeh

De-Yang Wu

Shao-Gang Cheng

A stand device includes a base, a supporting component and a carrying component. The supporting component is pivotally disposed to the base along a first axis. The carrying component is pivotally disposed to the supporting component along a second axis, and slidably disposed to the supporting component in a first direction. The stand device is switchable between a first state and a second state. In the first state, the extending direction of the supporting component is parallel to the extending direction of the base, and the extending direction of the carrying component is parallel to the extending direction of the supporting component. In the second state, the extending direction of the supporting component is staggered to the extending direction of the base, and the extending direction of the carrying component is staggered to the extending direction of the supporting component.

Stand device

Dual flip stand

An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip mounted on the electrode layer and the insulating layer, a phosphor sheet covering entirely a top surface of the LED chip, a first translucent layer disposed on a light emitting surface of the phosphor sheet, and a reflective housing covering the side surfaces of the LED chip and the side surfaces of the phosphor sheet. The light emitting surface has a central region and a ring-shaped region surrounding the central region. The first translucent layer covers at least 60% of an area of the ring-shaped region. A refractive index of the first translucent layer is larger than one and is smaller than that of the phosphor sheet. A top surface of the reflective housing is substantially flush with the light emitting surface.

LED package structure

Provided is a sun protection material including a plurality of polystyrene microspheres and a plurality of refractive layers. The polystyrene microspheres have a particle size of 150 nm to 300 nm. Surfaces of the polystyrene microspheres are at least partially covered by the refractive layers. The sun protection material can scatter a light in a wavelength range between 250 nm and 400 nm. A sun protection composition containing the sun protection material also may scatter a light of a wavelength range between 250 nm and 400 nm, such that the UV protection of the sun protection composition is enhanced.

Sun protection material and sun protection composition containing the same

A white light emitting device includes an LED chip capable of emitting light with a peak wavelength of 390 to 430 nm, and a wavelength conversion layer including first, second and third fluorescent materials. The first fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The second fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The third fluorescent material is capable of being excited to emit light with a peak wavelength of 630 to 650 nm. Light emitted by the white light emitting device has a color temperature below 5000 K, and a general color rendering index value (Ra) and special color rendering index values (R9-R15) all greater than 90.

White light emitting device

A server including a rack, at least one chassis, a plurality of electronic modules, and a cable module is provided. The rack has an opening. The chassis is movably disposed in the rack along a first axis, and moves in and out the rack through the opening. The electronic modules are vertically and detachably disposed in the chassis. A plurality of channels parallel to a second axis and each of the channels is disposed between two adjacent electronic modules, and the first axis is perpendicular to the second axis. The cable module is disposed at a side of the chassis. The cable module is connected to at least one of the electronic modules. When the chassis is moved out from the rack, the electronic module connected to the cable module is next to the opening of the rack.

Server

A chassis structure with interface card bracket is described, which uses a bracket to assemble an interface card in an accommodation space within a chassis. The bracket includes a carrying member and an operating member that are pivoted to each other, and the interface card is fixed on the carrying member. The chassis includes a guide portion disposed therein. As the bracket moves into the accommodation space, the carrying member and the operating member are pivoted with respect to each other upon being guided by the guide portion to form an appropriate included angle there-between, so as to avoid barriers around the accommodation space, thereby assembling the interface card into the accommodation space successfully.

Chassis structure with interface card bracket

Growing community of inventors

Taipei, Taiwan

Yi-Hsuan Chen