Coretronic Corporation

Yi-Hsing Peng

Wen-Chun Wang

Chung-Yang Fang

Chih-Jen Tsang

Bing-Han Tsai

Ching-Tai Tseng

A bonding method for an electronic element includes attaching a solder film to a display substrate and covering multiple bonding pads, performing a heat treatment step so that a solder layer on the multiple bonding pads is transformed into multiple solder bumps, providing at least one electronic element and covering the solder bumps, and heating the solder bumps to electrically bond the at least one electronic element and the bonding pads. The display substrate includes multiple display panels, a first adhesive layer, and a glass cover. The first adhesive layer and the glass cover are disposed on one side of the display panel away from the bonding pads. During the bonding process of the at least one electronic element and the bonding pads, no pressure is applied between the at least one electronic element and the bonding pads.

Bonding method for electronic element

A display device and a screen anti-peeping device are provided. The display device includes a display panel and the screen anti-peeping device. The display panel includes at least one bonding area, wherein the bonding area is configured to be coupled to an outer lead. The screen anti-peeping device overlaps with the display panel and includes a plurality of electrode sets, wherein each of the electrode sets includes a first electrode and a second electrode. At least one of the electrode sets is selected to be coupled to at least one control lead, and the selected electrode set is misaligned with the bonding area.

Display device and screen anti-peeping device

A light source module includes an optical plate, a light source and a dimming liquid crystal panel. The dimming liquid crystal panel includes a first driving substrate, a second driving substrate and a liquid crystal material layer. The first driving substrate includes a first substrate and a common electrode. The second driving substrate includes a second substrate, independent electrodes, first signal pads, first wires, dummy wires and a transparent insulation layer. The first wires and dummy wires are disposed on the second substrate and covered by the transparent insulation layer, the first wires are exposed from the transparent insulation layer, the independent electrodes are insulated from each other, disposed on the transparent insulation layer and overlap the first wires and the dummy wires, and each independent electrode is electrically connected to one first signal pad via one first wire. A display device having the light source module is also provided.

Growing community of inventors

Hsin-Chu, Taiwan

Yi-Hsing Peng