Powertech Technology Inc.

International Currency Technologies Corporation

Yi-hsin Chen

Hung-Yi Chang

Chia-Min Chang

Chia-Jen Chou

Chia-Hung Hu

Guang-Ren Shen

A package method of modular stacked semiconductor package is disclosed. A carrier and a plurality of the chip modules are provided. A plurality of redistribution layers are respectively formed in device areas of the carrier. The chip modules are stacked on the corresponding device areas of the carrier and are electrically connected to each other. A molding compound is formed on the redistribution layers on the carrier to encapsulate the chip modules. The carrier is removed to expose the redistribution layers. A plurality of solder balls are formed on the exposed redistribution layers. The molding compound is cut along adjacent edges of the device areas to form a plurality of modular stacked semiconductor packages. Since the chip modules are previously fabricated, connecting quality among the stacked chip modules is enhanced and is not affected by positioning error.

Growing community of inventors

Hukou, Taiwan

Yi-hsin Chen