Altek Semiconductor Corp.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Yi-Hong Tseng

Hong-Long Chou

Wen-Yan Chang

Tsan-Wei Wang

Che-Lun Chuang

Piao-Chuo Tsao

Yu-Chih Wang

Shu-Ling Feng

Chia-Chun Tseng

Tai-Chang Yang

Kuan-Liang Wu

Yi-Yi Yu

Hsin-Ming Hong

Yun-Wen Fu

Huei-Shan Lin

A lens module array for being assembled to a portable device is provided. The lens module array includes a wide-angle mono lens module, a narrow-angle mono lens module, and two color lens modules. While the wide-angle mono lens module, the narrow-angle mono lens module, and the two color lens modules are assembled onto the portable device, the wide-angle mono lens module, the narrow-angle mono lens module, and the two color lens modules are located at four vertices of a quadrangle, respectively. Besides, the two color lens modules are located at two opposite vertices.

Lens module array, image sensing device and fusing method for digital zoomed images

An image capturing device and a hybrid image processing method thereof are provided. The method is adapted to an image capturing device having a first lens and a second lens and includes the following steps. First, a scene is captured by the first lens and the second lens to respectively generate a mono image and a color image of the scene. Next, one of a mono image-based mode, a color image-based mode, and a color image-only mode is dynamically selected, and an output image is generated accordingly, wherein the mono image-based mode is to produce the output image by adding color image data onto the mono image, the color image-based mode is to produce the output image by adding mono image data onto the color image, and the color image-only mode is to produce the output image by only using the color image.

Image capturing device and hybrid image processing method thereof

An image processing system and a method for object-tracing are provided. The method includes: receiving a first wide field of view image and a first narrow field of view image, and determining a to-be-traced object therefrom and choosing one image therefrom for serving as a first output image; using an area size of the to-be-traced object in the first output image as a reference area; comparing the reference area with the area sizes of the to-be-traced object from a second wide field of view image and a second narrow field of view image respectively so as to determine one of that as a main image, and respectively zooming and deforming the main image and an area corresponding to the other image, and then fusing a zoomed and deformed second image as a second output image.

Image processing system and method for object-tracing

The present invention discloses a method of capturing images and an image capturing device using the method. The image capturing device has a first lens module and a second lens module having a view angle which is smaller than that of the first lens module. The method comprises: increasing an exposure time and reducing a light sensitivity value of the first lens module and capturing a first image by using the first lens module; reducing the exposure time and increasing the light sensitivity value of the first lens module and capturing a second image by using the second lens module; extracting a plurality of image features from the first image and the second image respectively and determining a region corresponding to the second image in the first image; and merging the second image into the region in the first image to generate an output image.

Method of capturing images and image capturing device using the method

An image capturing device and a digital zooming method thereof are proposed in the invention. The method includes the following steps. A scene is captured by a primary lens and a secondary lens to generate a primary image and a secondary image. Image rectification is then performed on the primary and the secondary images to obtain two corresponding rectified images. Feature points detected and matched from the two rectified images are used to determine a corresponding overlapping region, respectively. Pixel displacement and depth map in the two overlapping regions could be calculated and estimated. Image zooming and warping techniques are performed on the two rectified images to obtain corresponding warped images using a recalculated homography matrix according to each specific zooming factor. Finally, the two overlapping regions in the warped image are fused by a weighted blending approach to generate a digital zoomed image.

Image capturing device and digital zooming method thereof

An image capturing device and a digital zoom display method are provided. The device includes two lens modules configured to respectively capture a first image and a second image, and their capturing view fields are substantially identical, a preview processing unit configured to generate a third image by down-sampling the first image according to a display unit's resolution, a feature extraction unit, an image zooming and distortion unit and an image fusing unit. The second image is trimmed for generating a fourth image according to the same size of the third image. A pixel offset feature corresponding with the third and fourth images is generated by the feature extraction unit. The image zooming and distortion unit generates a fifth image and a sixth image according to the pixel offset feature and zoom ratio to the image fusing unit to generate a combined image displayed on the display unit.

Image capturing device and digital zoom display method

Disclosed are a method and a system for partially removing circuit patterns from a multi-project wafer. This method and this system can be used to provide a multi-project-wafer to a user without disclosing proprietary circuit information of other customers. At least one integrated circuit design of a user is identified from a plurality of integrated circuit designs of a plurality of users. Those unidentified circuits can be totally removed through circuit removing method. Then the modified multi-project wafer can be delivered to the user without concerns about disclosing information of unidentified circuits which belongs to other customers. In one embodiment, a laser system may be used to totally remove the unidentified integrated circuit designs without impacting the circuit performance of identified circuits. In another embodiment, a diamond-blade saw may also be used to totally remove the unidentified integrated circuit designs without impacting the circuit performance of identified circuits.

Methods for partially removing circuit patterns from a multi-project wafer

A system for multi-project wafer service is provided. The system contains integrator and designer interfaces, an account managing device, a mask tooling information processor, a mask database checking device, and a mask tooling information convertor. The integrator and the designer interfaces provide first and second users with access to the multi-project wafer service. The account managing device manages identification information and corresponding access authority. The mask tooling information processor provides a predefined form to the designer interface, receives the form containing the mask tooling information, and presents the completed form to the integrator interface. The mask database checking device compares the mask tooling information to preset data. The mask tooling information convertor converts the mask tooling information into mask tape-out information.

System and method for using MPW integration service on demand

The present disclosure provides a system and method for a tape-out request. In one example, the method includes receiving initial information from a customer and loading a mask tooling template based on the initial information. A mask tooling form may be customized based on metal layer information provided by the customer via the mask tooling template and answers to questions provided to the customer. The method may then generate logical operations based on information received from the customer via the mask tooling form.

System and method for customized tape-out requests for integrated circuit manufacturing

A method for translating mask tooling information comprises the steps of: receiving a plurality of input mask tooling forms for fabricating a wafer, at least two of the plurality of input masking tool forms having respectively different sequences of layers; forming a template having a sequence of layers formed by the union of the different sequences of layers; and translating information from each of the input mask tooling forms to fit the template.

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Hsinchu, Taiwan

Yi-Hong Tseng