Taiwan Semiconductor Manufacturing Comp. Ltd.

Yi Hang Lin

Shin-Puu Jeng

Po-Yao Lin

Shu-Shen Yeh

Chin-Hua Wang

Po-Chen Lai

Che-Chia Yang

Kuang-Chun Lee

A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a first chip structure and a second chip structure over the wiring substrate. The first chip structure is spaced apart from the second chip structure by a gap. The chip package structure includes a ring structure over the wiring substrate. The ring structure has a first opening, the first chip structure and the second chip structure are in the first opening, the first opening has a first inner wall, the first inner wall has a first recess, and the gap extends toward the first recess.

Chip package structure with ring structure

Growing community of inventors

Hsinchu, Taiwan

Yi Hang Lin