Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Yi-Chyng Fang

Yeu-Lih Lin

Di-Qiong Zhao

Gen-Cai Wang

Tay-Jian Liu

Ching-Bai Hwang

Fei Chen

Ke Wang

Wun-Chang Shih

Zhi-Ya Yang

Yue-Bin Wang

An LED illumination device includes an optical section disposed at a bottom end of the LED illumination device, and in which a light source is provided. A heat dissipation section located adjacent to the optical section includes a plurality of fins thermally contacting the light source. The electrical section is disposed at a top end of the LED illumination device and electrically connects with the light source. The heat dissipation section is disposed between the optical section and the electrical section. The electrical section defines a plurality of air exchanges communicating the inside of the electrical section with the heat dissipation section and a plurality of exhaust ports communicating the inside of the electrical section with an external environment of the LED illumination device.

LED illumination device

A memory module assembly () includes a memory card () having a right side surface () and a left side surface (), a heat sink () and a heat pipe (). The heat sink includes a base member () attached to the left side surface of the memory card and a shell () attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion () attached to the left side surface of the memory card and a support portion () extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator () in thermal engagement with one of the shell and the substrate portion and a condenser () in thermal engagement with the support portion.

Memory module assembly with heat dissipation device

A cooling fan includes a fan housing () having a central tube () extending upwardly therefrom, a bearing () received in the central tube, a stator () mounted around the central tube, a rotor (), and a cover (). The bearing defines a bearing hole () therein. The rotor includes a hub (), a plurality of blades () extending outwardly from the hub, and a shaft () extending downwardly from the hub into the bearing hole of the bearing. The cover is mounted around the shaft and arranged on the bearing to seal a top end of the bearing. The cover is made of powders by sintering and thus has a plurality of pores to generate capillary force to absorb lubricant oil leaking out of the bearing.

Cooling fan

A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.

Heat dissipating device and method for manufacturing it

A heat dissipation device includes a heat sink () and a fan () located above the heat sink for providing airflow. The heat sink includes a base () and a heat dissipating part () arranged on the base. The heat dissipating part includes a plurality of fins (), each adjacent pair of the fins defines a channel () therebetween. The heat dissipating part defines a plurality of passages () disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.

Heat dissipation device

A radiator includes a heat transfer base (), a heat dissipation member () secured to the heat transfer base and a fan () mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins () for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.

Growing community of inventors

Taipei Hsien, Taiwan

Yi-Chyng Fang