Taiwan Semiconductor Manufacturing Comp. Ltd.

Yi Chou Lai

Chen-Hua Douglas Yu

Wen-Chih Chiou

Kuang-Wei Cheng

Fang Wen Tsai

Jiung Wu

Jiann Sheng Chang

System and method for reducing substrate warpage in a thermal process. An embodiment comprises pre-heating a substrate in a loadlock chamber before performing the thermal process of the substrate. After the thermal process, the substrate is cooled down in a loadlock chamber. The pre-heat and cool-down process reduces the warpage of the substrate caused by the differences in coefficients of thermal expansion (CTEs) of the materials that make up the substrate.

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Taichung, Taiwan

Yi Chou Lai