Taiwan Semiconductor Manufacturing Comp. Ltd.

Yi-Ching Chiou

Ying-Hsiu Tsai

Jiun-Yu Lai

Wei-Chen Chang

Polishing systems and methods for polishing a substrate are provided. The method includes polishing a substrate using a polishing pad and monitoring a thickness of the polishing pad. The monitoring of the thickness of the polishing pad is performed by detecting an eddy current generated from a conductor element below a bottom surface of the polishing pad. The method also includes replacing the polishing pad with a second polishing pad if the thickness of the polishing pad is smaller than a predetermined value.

System and method for polishing substrate

Polishing systems and methods for polishing a substrate are provided. The polishing system includes a polishing assembly having a platen and a polishing pad over the platen. The polishing system also includes a substrate carrying assembly configured to engage a substrate to the polishing pad. The polishing system further includes a thickness sensing assembly configured to monitor a thickness of the polishing pad.

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Hsinchu, Taiwan

Yi-Ching Chiou