Playnitride Display Co., Ltd.

Yi-Ching Chen

Yi-Chun Shih

Pei-Hsin Chen

Yu-Chu Li

Tzu-Yang Lin

Yu-Hung Lai

Ying-Tsang Liu

Sheng-Yuan Sun

Kuan-Yung Liao

Huan-Pu Chang

Yun-Li Li

Zong Huei Tsai

Yu-Yun Lo

Chih-Ling Wu

Yi-Min Su

Jyun-De Wu

Kuang-Yuan Hsu

Shen-Jie Wang

Chi-Heng Chen

Yung-Chi Chu

Mi-Hung Lai

A micro light-emitting diode includes a first stacked layer, a second stacked layer, a third stacked layer, a bonding layer, at least one etch stop layer, and a plurality of electrodes. The second stacked layer is disposed between the first stacked layer and the third stacked layer. The first stacked layer includes a first active layer. The second stacked layer includes a second active layer. The third stacked layer includes a third active layer. The bonding layer is disposed between the second stacked layer and the third stacked layer. The at least one etch stop layer is at least disposed between the first active layer and the second active layer. The plurality of electrodes are respectively electrically connected with the first stacked layer, the second stacked layer, and the third stacked layer. At least one electrode of the plurality of electrodes contacts the etch stop layer.

Micro light-emitting diode

A multi-layer display module includes a first display panel, and a second display panel. Dimension of long side of the first display panel is D1, and the first display panel has first pixel resolution P1. The second display panel is located on one side of the first display panel and overlapped with the first display panel. There is a space d between the first display panel and the second display panel. Dimension of the long side of the second display panel is D2, and the second display panel has the second pixel resolution P2. Transmittance of the second display panel is T2. The multi-layer display module complies with T2>40%, P1≠P2, and

Multi-layer display module

A multi-layer display module includes a first display panel, and a second display panel. The second display panel is located on one side of the first display panel and overlapped with the first display panel. There is a space between the first display panel and the second display panel. Transmittance of the second display panel is T, luminance of the first display panel is L, and luminance of the second display panel is L. The multi-layer display module complies with

Multi-layer display module including two display panels with a space therebetween

A transparent display panel with a light-transmitting substrate, a plurality of top-emitting micro light emitting diodes, a plurality of bottom-emitting micro light emitting diodes, and a light shielding layer. The light transmissive substrate has a surface. These top-emitting micro light emitting diodes and these bottom-emitting micro light emitting diodes are disposed on the surface of the light transmissive substrate. The bottom-emitting micro light emitting diodes has an epitaxial structure and a light shielding member, the epitaxial structure has a pair of upper and lower surfaces on the opposite sides, the lower surface faces toward the light transmissive substrate, and the light shielding member is disposed on the upper surface to shield the light emitted by the bottom-emitting micro light emitting diodes towards the upper surface.

Transparent display panel

A micro LED display device includes a substrate, micro LED units and a transparent insulation layer. The substrate includes conductive pads and conductive connecting portions. The conductive pads are disposed on the substrate. Each of the micro LED units includes a semiconductor epitaxial structure and electrodes. The electrodes are disposed on the semiconductor epitaxial structure, and each of the electrodes is connected to one of the conductive connecting portions adjacent to each other. The transparent insulation layer is disposed on the substrate and covers the conductive pads, the conductive connecting portions and the micro LED units, and the transparent insulation layer is filled between the electrodes of each of the micro LED units. The transparent insulation layer relative to a surface on each of the semiconductor epitaxial structures is of a first thickness and a second thickness, and the first thickness is different from the second thickness.

Micro LED display device and manufacturing method thereof

A micro LED display panel and a pixel driving circuit thereof. The pixel driving circuit is used for driving a light-emitting unit, which includes a plurality of micro LEDs connected in series. The pixel driving circuit includes a switch unit, a driving unit and a selection unit. The switch unit controls a data signal input according to a scan signal. The driving unit is electrically connected to the switch unit and the light-emitting unit, and is electrically connected to a first voltage. The selection unit receives a selection signal and is electrically connected to a second voltage. The selection unit is electrically connected to the micro LEDs and the driving unit. The number and brightness of the micro LEDs to be turned on are controlled by the selection unit and the driving unit according to the selection signal and the data signal.

Micro light-emitting diode display panel and pixel driving circuit thereof

A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

Manufacturing method of micro LED display device

A micro light-emitting device display apparatus includes a driving substrate and a plurality of micro light-emitting devices. The micro light-emitting devices are disposed on the driving substrate. The micro light-emitting devices include a plurality of first, second and third micro light-emitting devices. Each of the first, the second and the third micro light-emitting devices respectively has a plurality of first, second, and third light-emitting regions independently controlled. A first light-emitting region of a first micro light-emitting device, a second light-emitting region of a second micro light-emitting device, and a third light-emitting region of a third micro light-emitting device are located in a first pixel region. A first light-emitting region of another first micro light-emitting device, a second light-emitting region of another second micro light-emitting device, and another third light-emitting region of the third micro light-emitting device are located in a second pixel region.

Micro light-emitting device display apparatus

A micro light-emitting device display apparatus includes a circuit substrate, at least one micro light-emitting device, and at least one conductive bump. The circuit substrate includes at least one pad. The micro light-emitting device is disposed on the circuit substrate and includes at least one electrode. At least one of the pad and the electrode has at least one closed opening. The conductive bump is disposed between the circuit substrate and the micro light-emitting device. The conductive bump extends into the closed opening and defines at least one void with the closed opening. The electrode of the micro light-emitting device is electrically connected to the pad of the circuit substrate with the conductive bump.

Micro light-emitting device display apparatus having bump

Herein disclosed are a micro-component transfer head, a micro-component transfer device, and a micro-component display. Said micro-component transfer head comprises a carrying surface that corresponds to a micro-component extraction area. Said extraction area conforms with a first geometric object, which comprises at least an acute angle. A second geometric object comprises at least a right angle and is constituted of n copies of the first geometric object, n being an integer greater than 1. The shape of the first geometric object differs from that of the second.

Micro-component transfer head, micro-component transfer device, and micro-component display

The present invention discloses a display panel and a head mounted device. The display panel includes a substrate and a plurality of micro light emitting units. A first position and a second position are defined at an edge and a center of the substrate respectively. The micro light emitting units are arranged and disposed on the substrate. Any two of the micro light emitting units are disposed at the first position and the second position respectively. Wherein each micro light emitting unit defines a luminating top surface, and a reference angle is defined between each luminating top surface and a reference plane respectively. Wherein the reference angle defined between each luminating top surface and the reference plane gradually decreases from the first position to the second position, and the luminating top surface of the micro light emitting unit located at the second position is parallel to the reference surface.

Display panel and head mounted device

The present invention discloses a substrate configured to receive a plurality of micro elements on a carrier board. The substrate comprises a body, a first conductive bump, and a second conductive bump. The body has a first surface, a transfer area is defined within the first surface, and a central portion and a peripheral portion is defined within the transfer area. The first conductive bump, disposed on the central portion, has a first volume. The second conductive bump, disposed on the peripheral portion, has a second volume. Wherein the first volume is different from the second volume.

Substrate and display device

A micro light emitting diode chip includes a light emitting layer, a first type semiconductor layer, and a second type semiconductor layer. The light emitting layer includes a metal element and a plurality of non-epitaxial media. The non-epitaxial media are separated from each other to disperse the metal element. A spacing between any two adjacent non-epitaxial media is less than 100 nanometers. The first type semiconductor layer is disposed on one side of the light emitting layer. The second type semiconductor layer is disposed on the other side of the light emitting layer.

Micro light emitting diode chip and micro light emitting diode wafer

A micro semiconductor device and a micro semiconductor display are provided. The micro semiconductor device includes an epitaxial structure, a first electrode, a second electrode and a supporting layer. The epitaxial structure has a bottom surface and a top surface, wherein the bottom surface is defined as a central region and a peripheral region. A first electrode and a second electrode are disposed on the central region of the bottom surface of the epitaxial structure, or the first electrode is disposed on the central region of the bottom surface of the epitaxial structure and the second electrode is disposed on the top surface of the epitaxial structure. The supporting layer is disposed on the peripheral region of the bottom surface of the epitaxial structure.

Micro semiconductor device and micro semiconductor display

A carrier structure suitable for transferring or supporting a plurality of micro devices includes a carrier and a plurality of transfer units. The carrier has a carrier surface and a plurality of recesses disposed on the carrier surface. The transfer units are respectively disposed in the recesses and a plurality of transferring surfaces are exposed. Each micro device has a device surface. The transferring surface of each transfer unit is configured to be connected to the device surface of the corresponding micro device. A micro device structure including the carrier structure is also provided.

Growing community of inventors

Miaoli County, Taiwan

Yi-Ching Chen