Epistar Corporation

Wistron Neweb Corporation

Mediatek Corporation

Realtek Semiconductor Inc.

Verizon Patent and Licensing Inc.

Yi-Chieh Lin

Wen-Luh Liao

Chih-Chiang Lu

Lan-Chun Yang

Rong-Ren Lee

Shih-Chang Lee

San-Yi Kuo

Hsin-Chan Chung

Yu-Ren Peng

Wen-Chou Wu

Ming-Hung Hung

Chien-Fu Huang

Shou-Lung Chen

Hung-Yuan Lin

Chun-Wei Wang

Hung-Ta Cheng

Yi-Ching Lee

Shih-Chia Chiu

Ming-Ta Chin

Bing-Chun Chung

Ming-Siang Huang

Man-Ning Lu

Chia-Liang Hsu

Tzu-Chieh Hsu

Shih-I Chen

Li-Han Hsu

Yen-Ju Lu

Chun-Hung Huang

Cheng-Ta Kuo

Hsing-Chih Liu

Chang-Lin Wei

Yung-Fu Chang

Shiuan-Leh Lin

Yu-Hsin Chen

Mei-Chun Liu

Ying-Chou Shih

Yu-Pin Hsu

Yi Hsiao

Chia-Yu Jin

Sheng-Wei Lei

Jing-Hui Zhuang

Che-Hsien Huang

Hong-Chi Shih

Min-Hsun Hsieh

Reid Andersen Schlegel

Hsin-Hsien Wu

Shih-Hong Chen

Wun-Jian Lin

Ming-Chan Lee

Bau-Yi Huang

Chiung-Wen Hsin

Andrew Nicholas Toth

Cheng-Long Yeh

Chun-Kai Wang

Jui-Yi Chu

Kun-Hsien Lee

Szu-Yuan Chen

Cheng-Hsiung Lu

Robert Stewart

Christopher Emmons

Hung-Ming Chang

Jiunn-Nan Hwang

Chih-Yang Liu

Huei-Chi Wu

Amrit Bamzai

Bo-Yen Chen

Man Ning Lu

Li-Hsien Peng

Yu-Cheng Yu

Chi-Ming Tsai

Po-Chang Chu

This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.

Test kit for testing a device under test

A communication apparatus and a bracket device thereof are provided. The bracket device includes a base, a rotary shaft, a connecting member, and an elastic member. The base includes a bottom portion, a connecting portion, and a base engaging portion. The rotary shaft is rotatably disposed in the connecting portion and includes a base wall and a connecting section. The connecting member connects to the rotary shaft. The elastic member includes a body and an elastic member engaging portion. The body connects to the base wall of the rotary shaft, and the elastic member engaging portion is positioned at the body. In an engagement state, the elastic member engaging portion is engaged to the base engaging portion.

Communication apparatus and bracket device thereof

A semiconductor package includes a first package having a first side and a second side opposing the first side. The first package comprises a first electronic component and a second electronic component arranged in a side-by-side manner on the second side. A second package is mounted on the first side of the first package. The second package comprises a radiative antenna element. A connector is disposed on the second side.

Semiconductor package having discrete antenna device

A bracket is provided. The bracket includes a fixing seat and a holding seat. The fixing seat has a first extending direction and includes at least one first contacting end surface, and a first angle is contained between the at least one first contacting end surface and the first extending direction. The holding seat is detachably connected to the fixing seat with a bend angle to form a bend structure, and the holding seat includes at least one second contacting end surface corresponding to the at least one first contacting end surface. The at least one first contacting end surface and the at least one second contacting end surface are located near or at a bend portion of the bend structure.

Bracket

This disclosure discloses an optical sensing device. The device includes a carrier body having a topmost surface; a first light-emitting device disposed on the carrier body and having a light-emitting surface; and a light-receiving device comprising a group III-V semiconductor material disposed on the carrier body and having a light-receiving surface. The light-emitting surface is separated from the topmost surface by first distant H, the light-receiving surface is separated from the topmost surface by a second distance H, and His different from H

Optical sensing device and optical sensing system thereof comprising light emitting device and light receiving device completely sandwiched by the topmost surface and bottommost surface of a carrier body with different vertically separated distances

A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.

A vertical interconnection structure of a multi-layer substrate includes a first via pad disposed in a first layer of metal interconnect of the multi-layer substrate; a second via pad disposed in a second layer of metal interconnect of the multi-layer substrate; a signal via electrically connecting the first via pad to the second via pad; a non-circular first ground plane disposed in the first layer of metal interconnect of the multi-layer substrate and surrounding the first via pad; and a non-circular first ground pullback region between the first via pad and the non-circular first ground plane for electrically isolating the first via pad from the non-circular first ground plane.

Vertical interconnection structure of a multi-layer substrate

Wireless communications device

A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.

Filter circuits

A waterproof device including a casing structure, a cover structure, a first engaging plate, a second engaging plate, a first elastic member, and a second elastic member is provided. The casing structure, on which the cover structure is disposed, includes a bottom plate, a first side plate, a second side plate, a third side plate, and a fourth side plate. The first engaging plate is disposed adjacent to the first side plate, and the first elastic member is connected therebetween. The second engaging plate is disposed adjacent to the second side plate, and the second elastic member is connected therebetween. The first engaging plate can reciprocate between a first positioning position and a first disengagement position relative to the first side plate, and the second engaging plate can reciprocate between a second positioning position and a second disengagement position relative to the second side plate.

Waterproof device

An orientation-adjustment mechanism is provided, which is adapted to be affixed to a mounting surface. The orientation-adjustment mechanism includes a base, a rod, a joint unit, and a mounted member. The base is adapted to be affixed to the mounting surface. The rod includes a first section and a second section. The first section of the rod pivots on the base. The joint unit is disposed on the second section of the rod. The joint unit includes a plurality of joint-positioning portions. The joint-positioning portions include a first joint-positioning portion and a second joint-positioning portion. The mounted member is connected to the joint unit and is adapted to be rotated relative to the joint unit. The mounted member includes a member housing. The member housing includes at least one member-positioning portion.

Orientation-adjustment mechanism

A semiconductor package includes a bottom chip package having a first side and a second side opposing the first side. The bottom chip package comprises a first semiconductor chip and a second semiconductor chip arranged in a side-by-side manner on the second side. A top antenna package is mounted on the first side of the bottom chip package. The top antenna package comprises a radiative antenna element. A connector is disposed on the second side.

Pedestal for wireless signal transmission device

A bracket structure is provided. The bracket structure includes a base, a connection pipe and at least one cascade member. The base includes a base body, a first connection protrusion and a second connection protrusion. The first connection protrusion and the second connection protrusion are affixed to the base body. The first connection protrusion includes a first contact surface. The second connection protrusion includes a second contact surface. The first contact surface faces the second contact surface. The connection pipe includes an extending section, a fitting section and a pivot section. The cascade member pivots on the first connection protrusion, the pivot section and the second connection protrusion. The pivot section includes a first abutting surface and a second abutting surface. The first abutting surface forms a surface-to-surface contact with the first contact surface. The second abutting surface forms a surface-to-surface contact with the second contact surface.

Bracket structure

This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is &#x2265;13.

Optical sensing device and optical sensing system thereof comprising a light receiving device capable of receiving a first received wavelength having a largest external quantum efficiency

Growing community of inventors

Hsinchu, Taiwan

Yi-Chieh Lin