Taiwan Semiconductor Manufacturing Comp. Ltd.

Yi-Chieh Huang

Hsiang-Fu Chen

Chia-Ming Hung

Kuan-Chi Tsai

I-Hsuan Chiu

Kang-Yi Lien

A semiconductor device and method of manufacturing the device that includes a growth die and a dummy die. The method includes patterning, on an integrated circuit wafer, at one least growth die, and patterning at least one dummy die that is positioned on at least a portion of a circumference of the integrated circuit wafer. The patterned growth and dummy dies are etched on the wafer. A bond wave is initiated at a starting point on the integrated circuit wafer. The starting point is positioned on an edge of the integrated circuit wafer opposite the portion on which the at least one dummy die is patterned. Upon application of pressure at the starting point, a uniform bond wave propagates across the wafers, bonding the two wafers together.

Growing community of inventors

Tainan, Taiwan

Yi-Chieh Huang