Wiwynn Corporation

Yi Cheng

Ting-Yu Pai

Tsung-Han Li

Chin-Han Chan

Li-Wei Chen

Chun-Wei Lin

Tai-Ying Tu

Chin-Hao Hsu

Zi-Ping Wu

Kang-Bin Mah

Jun Da Chen

Zi Ping Wu

Wei-Ching Chang

The invention provides an immersion fluid module including a tank, a heat exchanger, a condenser, and at least one pipe. The tank contains a first fluid. An electronic device is disposed in the tank and is at least partially immersed in the first fluid in a liquid state. The heat exchanger is disposed in the tank and is at least partially immersed in the first fluid in the liquid state. The condenser is disposed in the tank. The pipe connects the heat exchanger and the condenser. A second fluid is provided to the pipe, and a temperature of the second fluid is higher than a preset value. When an ambient temperature of the electronic device is lower than the preset value, the second fluid flows through the heat exchanger to raise the ambient temperature of the electronic device. The invention also provides a server system.

Immersion fluid module and server system

An immersion cooling system includes a box body, a condensing structure and a pressure adjusting module. The box body has a first containing space, the first containing space is adapted to contain a heat dissipation medium, and at least one heat generating component is disposed in the first containing space to be immersed in the heat dissipation medium which is in liquid state. The condensing structure is disposed in the first containing space and above the heat dissipation medium which is in liquid state. The pressure adjusting module is adapted to actively drive a fluid in the first containing space to flow into the second containing space, such that a pressure in the first containing space is reduced to be less than an external pressure. In addition, an electronic apparatus having the immersion cooling system and a pressure adjusting module are also provided.

Immersion cooling system and electronic apparatus having the same and pressure adjusting module

A flow dividing device including a box body and a baffle set is provided. The box body includes a chamber, an inflow port, and an outflow port. The baffle set is located in the chamber and divides the chamber into a plurality of guide channels, and two ends of the guide channel communicate with the inflow port and the outflow port respectively. After flowing into the flow dividing device, the condensate fluid can guide different liquids in the condensate fluid to separate from each other. An immersion cooling system including the flow dividing device and a fluid separation method of the immersion cooling system are also provided.

Flow dividing device and immersion cooling system having the same

A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.

Package assembly

A separate immersion cooling system includes a separate immersion cooling device. The separate immersion cooling device includes a condensing device, a plurality of cooling tanks, a plurality of outflow pipes and a plurality of return pipes. The separate immersion cooling device is adapted to cooling a heat-generating device immersed in the cooling tank.

Separate immersion cooling device and separate immersion cooling system having the same

An electronic apparatus including at least one heat generating component and an immersion cooling system is provided. The immersion cooling system includes a box body and a condensation module. The box body is adapted to accommodate a coolant, and the heat generating component is disposed in the box body to be immersed in the coolant in a liquid state. The condensation module includes a pipeline and a condensate, and the pipeline passes through the box body and is adapted for the condensate to flow. At least one parameter of the condensate may be changed to lower a boiling point of the coolant to a predetermined value by lowering the temperature in the box body with the condensate. In addition, an operating method of the electronic apparatus is also provided.

Growing community of inventors

Taipei, Taiwan

Yi Cheng