Au Optronics Corporation

Yi-Cheng Liu

Ho-Cheng Lee

Wen-Wei Yang

Chung-Chan Liu

Chin-Yuan Ho

Chen-Chi Lin

Tsung-Shiun Lee

Cheng-Chieh Chang

Ting-Wei Guo

Sheng-Yu Hsu

Shao-Wen Yen

An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometers or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.

Method for fabricating the electronic component, and method for transposing a micro-element

A pixel structure includes at least one sub-pixel. The sub-pixel includes a substrate, a first micro light-emitting element, a repair micro light-emitting element, a first connecting line, a second connecting line, and a bridge pattern. The first micro light-emitting element is disposed on the substrate. The repair micro light-emitting element is disposed on the first micro light-emitting element and partially overlaps the first micro light-emitting element in a vertical direction of the substrate. The first connecting line is electrically connected to a first electrode of the first micro light-emitting element and a third semiconductor layer of the repair micro light-emitting element. The second connecting line is electrically connected to a second electrode of the first micro light-emitting element. The bridge pattern is located between the first micro light-emitting element and the repair micro light-emitting element, and is electrically connected to the second electrode and a fourth semiconductor layer of the repair micro light-emitting element.

Pixel structure

The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.

Electronic device and method for fabricating the same

An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometer or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.

Electronic component, transposing component, method for fabricating the electronic component, and method for transposing a micro-element

A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.

Display panel

Display panel and method for forming micro component support

A flexible display includes a display panel, a gate driver, and a bending sensing unit. The display panel has a plurality of rows of pixels arranged in sequence. The gate driver has a plurality of stages of shift register circuitries electrically coupled to each other in sequence. The shift register circuitries are electrically coupled to the plurality of rows of pixels, and are configured to provide a plurality of refreshing pulses for driving the plurality of rows of pixels to refresh. Each stage of the shift register circuitries are further configured to provide a trigger pulse to drive another stage of the shift register circuitries. The bending sensing unit is electrically coupled to the gate driver. The bending sensing unit is configured to control, according to bending of the display panel, the impedance of a path used by at least one of the stages of the shift register circuitries to transmit the trigger pulse to the other stage of the shift register circuitries.

Flexible display with power consumption

A display and a sub-pixel driving method therein are provided. The display includes a data line and a sub-pixel. The data line is configured to provide a data voltage signal. The sub-pixel includes a driving unit, a first light-emitting unit and a second light-emitting unit. The driving unit is configured to generate a driving current according to the data voltage signal. The first light-emitting unit is configured to emit light by the driving current and generate an operating voltage according to the driving current. The second light-emitting unit is selectively substituted for the first light-emitting unit to emit light according to a variation of the operating voltage.

Display and sub-pixel driving method therein

A display device includes a substrate, display units, and a plurality of integrated circuits (ICs). The substrate includes an active area and a non-active area. The non-active area is located around the active area. The display units are disposed in the active area of the substrate, and arranged in a matrix. The ICs are disposed in the active area of the substrate, arranged in a matrix, and are electrically coupled to the display units. Each of the ICs includes a shift register unit. Each of the shift register units of the ICs is configured to receive a previous-stage scan signal, and generate a current-stage scan signal according to the previous-stage scan signal. The ICs drive the display units according to the current-stage scan signals.

Growing community of inventors

Hsin-Chu, Taiwan

Yi-Cheng Liu