Kingpak Technology Inc.

Yi-Cheng Juan

Han-Hsing Chen

A defect inspection method for a sensor package structure includes: using an image capture device to separately focus on and take pictures of at least three to-be-inspected regions of the sensor package structure along a height direction, so as to respectively obtain a defect image from one of the to-be-inspected regions, wherein the defect images are aligned with each other along the height direction and have different grayscale values; determining the defect image having a maximum grayscale value as a reference defect image, and defining any of the remaining defect images as a to-be-confirmed defect image; multiplying the maximum grayscale value by a predetermined grayscale ratio to obtain a predicted grayscale value, and confirming whether a difference between the to-be-confirmed and predicted grayscale values falls within an error range.

Defect inspection method for sensor package structure

An inspection apparatus includes a focus assistant loader and a camera assembly. The focus assistant loader includes a fetching member and a focus member connected to the fetching member. The focus member includes a plurality of focus portions respectively located at different levels. The camera assembly includes a plurality of cameras. The cameras may face the focus assistant loader and respectively focus on the focus portions. Thus, by using the cameras to focus on the focus portions, the inspection apparatus may find out tiny defects on a tested device held by the focus assistant loader. In addition, the present disclosure also discloses a focus assistant loader of an inspection apparatus and a method for inspecting a sensor package structure.

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Hsin-Chu County, Taiwan

Yi-Cheng Juan