Advanced Semiconductor Engineering, Inc.

National Sun Yat-Sen University of Kaohsiung

Yi-Cheng Hsu

Chih-Hung Hsu

Mei-Lin Hsieh

Kuang-Hsiung Chen

Yu-Shun Hsieh

Ko-Pu Wu

Yuan-Chun Chen

Wood-Hi Cheng

Yueh-Chen Hsu

Chin Li Huang

A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.

Lead frame, package structure and method for manufacturing the same

A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.

Device including a plurality of leads surrounding a die paddle and method for manufacturing the same

A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.

Leadframe and chip package

The present invention relates to a method and apparatus for measuring the position of a ferrule of a laser module. The apparatus comprises an XYZ stage, a base, a receiving portion and a laser displacement meter (LDM). The XYZ stage is used for moving in three-dimensional directions. The base has a first slot by which the base is detachably connected to the XYZ stage. The receiving portion is fixed to the base and has a second slot. The laser displacement meter is used for measuring the distance between the ferrule and the laser displacement meter. The laser displacement meter is detachably connected to the receiving portion in the second slot. Whereby, the quantitative measurement and correction to the effect of the postweld-shift (PWS) on the fiber alignment shifts in laser-welded laser module packaging is achieved. Therefore, the reliable laser modules with high yield and high performance used in low-cost lightwave transmission systems may be developed and fabricated.

Method and apparatus for measuring the position of ferrule of a laser module

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Kaohsiung, Taiwan

Yi-Cheng Hsu