Innolux Corporation

Yi-Chen Chou

Wen-Hsiang Liao

Ker-Yih Kao

Yi-Hung Lin

Cheng-Chi Wang

Fuh-Tsang Wu

Wan-Ting Ke

Allen Tseng

A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.

Manufacturing method of package structure

A method of manufacturing a light source carrier with at least one light source, including: providing a substrate with a plurality of light source groups disposed thereon, wherein each light source group includes the at least one light source; irradiating a first light upon one of the light source groups through a first mask; capturing a photoluminescent light emitted by the one of the light source groups to acquire data; comparing the data with a reference to determine whether the one of the light source groups is qualified; providing a carrier; and transferring the one of the light source groups from the substrate to the carrier if the one of the light source groups is qualified.

Methods of manufacturing a light source carrier and an electronic device, and a light source qualification method

Growing community of inventors

Miao-Li County, Taiwan

Yi-Chen Chou