National Taiwan University

Taiwan Semiconductor Manufacturing Comp. Ltd.

Himax Technologies, Inc.

Yi-Chang Lu

Kuen-Yu Tsai

Tsung-Yu Wu

Meng-Fu You

Cheng-Hung Li

Chung-Yui Kuo

The present disclosure relates to a curve-fitting procedure for determining proximity effect device parameters in semiconductor fabrication. Methods presented herein are adapted to determine the impact of narrow width related effects on device characteristics by comparing two-dimensional (2D) and/or three-dimensional (3D) device simulations. Methods presented herein are adapted to determine the accuracy of conventional extraction methods utilizing non-rectangular gate device simulation.

Determining proximity effect parameters for non rectangular semiconductor structures

The present disclosure relates to a curve-fitting procedure for determining proximity effect device parameters in semiconductor fabrication. Methods presented herein are adapted to determine the impact of narrow width related edge effects on device characteristics by comparing two-dimensional (2D) and/or three-dimensional (3D) device simulations. Methods presented herein are adapted to determine the accuracy of conventional extraction methods utilizing non-rectangular gate device simulation.

Determining proximity effect parameters for non-rectangular semiconductor structures

A layout of a voltage/current reference system is disclosed. A first voltage/current reference circuit (for example, a bandgap reference circuit) and a second voltage/current reference circuit are respectively laid out on either side of a substrate, such as edges or perimeter sides of the substrate. A reference voltage/current is derived by averaging respective output reference voltage/current values of the first and the second voltage/current reference circuits. Accordingly, the noise influence on the voltage/current reference system is minimized.

Layout of a reference generating system

A power distribution system is disclosed. The system includes a first power line and a second power line laid out on a substrate. The first power line is spaced apart from the second power line. The system also includes at least one conductive connecting line that electrically couples the first power line at one end and the second power line at another end. A power supply supplies power to the first power line and the second power line. A supply node on the conductive connecting line is then used to provide the supplied power.

Growing community of inventors

Linkou, Taiwan

Yi-Chang Lu