Taiwan Semiconductor Manufacturing Comp. Ltd.

Yi-Chang Lee

Chih-Hao Chen

Jiann-Horng Lin

Wen-Yen Chen

Shu-Huei Suen

Ying-Hao Wu

Shih-Hua Tseng

Che-Kang Chu

In a pattern formation method, a photo resist pattern is formed over a target layer to be patterned. An extension material layer is formed on the photo resist pattern. The target layer is patterned by using at least the extension material layer as an etching mask.

Pattern formation method and method for manufacturing a semiconductor device

An embodiment is a method of fabricating a semiconductor structure. The method includes utilize uses of a multi-layer structure disposed on a pattern defining layer. In some embodiments, a method of fabricating a semiconductor structure includes forming a first multi-layer structure on a pattern defining layer disposed on a film stack on a substrate, patterning the first multi-layer structure to form an aperture in the first multi-layer structure, forming a first cut opening in the pattern defining layer through the aperture defined by the first multi-layer structure, and forming a second multi-layer structure on the pattern defining layer, a portion of the second multi-layer structure being disposed in the first cut opening.

Multiple layer scheme patterning process

Growing community of inventors

Taoyuan, Taiwan

Yi-Chang Lee