Via Technologies, Inc.

Corning Incorporated

Wistron Corporation

Winbond Electronics Corporation

Shenzhen Goldsun Network Intelligence Technology Co., Ltd.

Vatics Inc.

Yi-An Chen

Ping-Huei Hsieh

Chih-Wei Chen

Chung-Chih Hung

Yu-Teng Chang

Windsor Pipes Thomas, Iii

Yung-Jean Lu

Hsin-Chi Chen

Hsiang-Ho Lo

Ying-Chi Wu

Der-Chun Cherng

Pei-Chen Wu

A method of fabricating a casing including steps of providing a polycarbonate substrate, printing a first material on the polycarbonate substrate to form a light shielding layer by using a first screen, and printing a second material on the light shielding layer to form a light transmission layer by using a second screen is provided. The light shielding layer has at least one patterned transmissive region. The light transmission layer covers the at least one patterned transmissive region and a portion of polycarbonate substrate exposed by the at least one patterned transmissive region. Mesh counts of the first screen is greater than that of the second screen. A casing including a polycarbonate substrate, a light shielding layer, and a light transmission layer is provided. A thickness of the light transmission layer is greater than a thickness of the light shielding layer. An electronic device adopting the casing is provided.

Casing, electronic device, and method of fabricating casing

An image stitching method applied to an image stitching device having at least two image capturing units and an operation processing unit includes acquiring at least two images adjacent by each other, detecting an overlapped region of the two adjacent images, compiling statistics of image information about the overlapped region of the two adjacent images, utilizing the image information to compute a compensation function, and adjusting at least one of the two adjacent images according to the image information to make the image information of the two adjacent images into harmony.

Image stitching method and image stitching device

A charging structure including a power supply device, a rechargeable battery and a charging management device is provided. The power supply device is configured to provide a system voltage. The charging management device is configured to switch a corresponding charging mode according to the voltage level of the positive end of the rechargeable battery. The charging management device stops charging action when a charging current for charging the rechargeable battery drops down to a pre-set current value.

Charging structure

A graphics processing unit (GPU) and a management method of the GPU are provided. The GPU includes at least one graphics engine and an engine manager. The graphics engine performs a video decoding function or a graphics rendering function according to a graphics command from a driver software. The engine manager records a workload index of each graphics engine. The engine manager also adjusts the work ability of one of or more of the at least one graphics engine according to an adjustment command from the driver software. The driver software provides the adjustment command according to the workload index.

Graphics processing unit and management method thereof

A mobile terminal includes a touchpad, a background system, and a MEMS gyroscope. The background system includes a control module, an indicating needle displaying module, and a divided circle displaying module. The indicating needle displaying module displays an indicating needle in the touchpad. The divided circle displaying module displays a divided circle in the touchpad. Each scale of the divided circle corresponds to a code. The divided circle rotates with the mobile terminal to enable the indicating needle to be aligned with one scale of the divided circle. The MEMS gyroscope holds the indicating needle to be unmovable. The touchpad sends the one code to the control module after sensing a click gesture. The control module unlocks the mobile terminal after determining that a plurality of codes sent by the touchpad matches predetermined codes.

Unlocking mobile terminal and unlocking method

A three-dimensional integrated circuit (3D-IC) which incorporates a glass interposer and a method for fabricating the three-dimensional integrated circuit (3D-IC) with the glass interposer are described herein. In one embodiment, the 3D-IC incorporates a glass interposer which has vias formed therein which are not filled with a conductor that allow for precision metal-to-metal interconnects (for example) between redistribution layers. In another embodiment, the 3D-IC incorporates a glass interposer which has vias and has a coefficient of thermal expansion (CTE) that is different than the CTE of silicon which is 3.2 ppm/&#xb0; C.

Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same

One embodiment is a method for establishing a link between a source device and a sink device. The method comprises enabling a hot plug detect (HPD) handler in the source device, utilizing the HPD handler to receive an HPD interrupt upon the sink device being coupled to the source device, applying one or more predetermined parameters corresponding to the HPD interrupt to establish the link between the source device and the sink device, and adjusting the one or more predetermined parameters if the link between the source device and the sink device is not established.

Growing community of inventors

Taipei, Taiwan

Yi-An Chen