Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Other

Agilent Technologies, Inc.

Avago Technologies General IP (singapore) Pte. Ltd.

Intellectual Discovery Co., Ltd.

Avago Technologies Ecbu IP Pte. Ltd.

Yew Cheong Kuan

Kee Yean Ng

Wen Ya Ou

Thye Linn Mok

Kian Shin Lee

Cheng Why Tan

Kong Weng Lee

Norfidathul Aizar Abdul Karim

Gin Ghee Tan

Fakhrul Arifin Mohd Afif

Kheng Leng Tan

Siew It Pang

Su Lin Oon

Janet Bee Yin Chua

Tong Fatt Chew

Heng Yow Cheng

Sundar Natarajan Yoganandan

Gim Eng Chew

Joon Chok Lee

Seong Choon Lim

Kevin Len Li Lim

Eit Thian Yap

Hong Huat Yeoh

Hui Peng Koay

Kar Phooi Foong

Elizabeth Ching Ling Fung

Ng Fook Chuin

Kevin John Theseira

Sundar Natarajan Yogananadan

Klan Shin Lee

Slew It Pang

Kheng Guan Peh

Yih Sien Teh

A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

Semiconductor device with a light emitting semiconductor die

A light source and a method for operating the same are disclosed. The light source includes a light emitter and a controller. The light emitter generates light in response to a control signal coupled thereto. The light emitter is characterized by an age related to the amount of light that has been cumulatively generated by the light emitter, the generated light for a given control signal changing with the age. The controller measures the age of the light emitter and generates the control signal based on the desired light intensity and the measured age of the light emitter. In one embodiment, the controller stores an age value for the light emitter, and the controller determines the control signal in response to an input signal specifying a desired light intensity from the light emitter, the controller updating the age value each time the control signal is determined.

Color management system

A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.

A light source that has improved light mixing. The light source uses a nanolens layer in conjunction with an LED light source to enhance the mixing of the colored light emitting from the LED light source.

LED light source with light-directing structures

A light-emitting diode ('LED') device includes a plurality of LEDs. Each LED in the plurality of LEDs is adjacent to at least one other of the plurality of LEDs. At least one of the plurality of LEDs has a radiation with a full-width-half-maximum greater than 50 nm.

Light-emitting diode flash module with enhanced spectral emission

In one embodiment, light emitted by a plurality of solid-state light emitters is mixed by mounting the plurality of solid-state light emitters on a transparent to translucent substrate so that they primarily emit light away from the substrate. The light emitters are then covered with a transparent to translucent encapsulant; and the encapsulant is coated with a reflective material that reflects light emitted by the light emitters toward the substrate. Related apparatus is also disclosed.

Method and apparatus for mixing light emitted by a plurality of solid-state light emitters

A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same

The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Packaging device for semiconductor die, semiconductor device incorporating same and method of making same

Illumination apparatus includes a support structure, at least one light emitting element, and a heat sink thermally coupled to the light emitting element. The light emitting element and heat sink are moveable in relation to the support structure. An actuator system moves the at least one light emitting element and the heat sink with respect to the support structure.

Illumination apparatus and method

A system and method for a reverse mounted light array. In one method embodiment, the present invention couples a reverse mounted light-generating source with a substrate. Additionally, the present invention couples an electrical portion of the reverse mounted light generating source with a conductive trace coupled to the reverse side of the substrate, wherein the coupling of the conductive trace with the substrate and the reverse mounted light generating source forms a reverse mounted light array.

Method, system and device for delivering phototherapy to a patient

A light source is disclosed. The light source has a light-emitting chip that includes an LED that generates light in an active region thereof. The LED emits a light signal in a forward direction, and infrared radiation generated in the active region is emitted in a side direction in the form of a first infrared signal. The first light signal is determined by a first drive signal coupled to the LED. The light source also includes an infrared detector positioned to collect a portion of the infrared signal. The infrared detector generates a heat signal indicative of the amount of infrared radiation detected. A controller generates the drive signal so as to maintain the heat signal at a first target value. In light sources having LEDs that emit in different spectral ranges, the infrared detectors can all detect heat in the same spectral range.

Light source utilizing an infrared sensor to maintain brightness and color of an LED device

A system and method for emitting and detecting light uses a light emitting device, e.g., a light emitting diode, to emit light and to detect incident light. As an example, the system and method may be used in a digital camera, a camera phone or an illuminated device, such as a liquid crystal display device.

System and method for emitting and detecting light using light emitting diode

An illumination unit includes a thin and flexible substrate and flexible electrical tracks formed on the flexible substrate. A number of solid-state light generating sources are arranged on the flexible substrate along the electrical tracks and are electrically connected to the electrical tracks. A flexible and optically transparent encapsulant is provided to encapsulate the light generating sources on the substrate such that the illumination unit is both thin and flexible.

Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant

A light unit is provided that includes a thin flexible substrate layer. A number of flexible electrical tracks are formed on the flexible substrate layer. A number of Light Emitting Diodes (LEDs) are arranged on the flexible substrate layer along the electrical tracks and are electrically connected to the electrical tracks such that the light unit is both thin and flexible.

Light unit having light emitting diodes

A LED of flip-chip design comprises a light emitting region and one or more transparent substrates overlying the light emitting region. The light emitting region includes a negatively doped layer, a positively doped layer, and an active p-n junction layer between the negatively doped layer and the positively doped layer. At least one of the substrates has a pyramidal shape determined by (1) the composition of electrically conductive or electrically non-conductive material, (2) the number of side surfaces, (3) the degree of offset of an apex or top surface, and (4) the slope angle of each side surface relative to a bottom surface.

Growing community of inventors

Penang, Malaysia

Yew Cheong Kuan