Foxconn Precision Components Co., Ltd.

Yeu-Lih Lin

Chao-Yang Lee

Chao Kun Tseng

Chung-Yung Sun

Ai-Min Huang

Aimin Huang

A heat dissipation device includes a heat sink ( ) and an assembling device for securing the heat sink to a, chip ( ) mounted on a printed circuit board ( ). The heat sink has a pair of ears ( ) each defining an aperture ( ) therein. The assembling device includes a clip ( ), a pair of sleeves ( ) each defining a cavity ( ) therethrough, and a pair of springs ( ). Each sleeve extends through the aperture of a corresponding ear of the heat sink, and the springs are disposed respectively between the ears and an end of the sleeves. The clip has a pair of posts ( ) for extending through the printed circuit board to engage with the corresponding cavities.

Heat dissipation device for integrated circuits

A heat sink assembly includes a heat sink (,), a fan (,) and a fixing device (,). The heat sink has a plurality of fins (,). The outermost fins define catches (,). The fixing device includes an upper portion (,) and a lower portion (,). The upper and lower portions respectively define upper and lower openings (,) providing air flow access for the fan. A pole (,) depends from each comer of the upper portion. The fan has first through holes (,) for extension of the poles therethrough. A pair of latches (,) extends upwardly from the lower portion, for engaging with the upper portion. The upper portion defines two cutouts (,) in communication with the upper opening, for receiving the latches. A side wall (,) depends from each of two opposite sides of the lower portion. Each side wall defines two recess (,) at respective opposite ends thereof. A barb (,) is formed at each opposite end of each side wall, for engaging with the corresponding catch of the heat sink.

Heat sink assembly

A heat sink includes a base and a number of fins extending from a top face of the base. A groove is defined in a bottom face of the base opposite the fins for receiving a flip chip of a flip chip processor thereby reducing damage to the flip chip during mounting the heat sink to the flip chip processor. At least one elongate protrusion extends from the base for engaging with an edge of a substrate of the flip chip processor to properly position the heat sink with respect to the flip chip processor.

Heat sink for integrated circuit

A clip assembly (,) includes a nail member (,), a sleeve member (,), and a spring (,) around the sleeve member. The nail member includes a cap (,), a post (,), a neck (,) and a cone-shaped barb (,). A pair of wedges (,) is formed on an outer surface of the post. The sleeve member is cylindrical. The sleeve member defines a central bore (,) for receiving the nail member, and a pair of rectangular slots (,) for receiving the wedges. A circumferential shoulder (,) is formed on the sleeve member, for abutting against a bottom surface of a heat sink. A lower portion (,) of the sleeve member defines cutouts (,), thereby also forming deformable fingers (,). The sleeve member is interposed between the heat sink and a PCB. The nail member is inserted down through the lower portion, and elastically expands the fingers of the sleeve member.

Heat sink clip assembly

A heat sink assembly for use in conjunction with an electronic integrated circuit, such as a chip, comprises a heat sink and a pair of retainers. The heat sink includes a plate defining a large number of fins and a flat bottom surface. A locking protrusion is formed at a proper position of each side of the plate. Each retainer comprises a transition portion, two engaging arms perpendicular to each other, and a nail beneath the transition portion. A rectangular sheath is formed on a distal end of each engaging arm for cooperating with a corresponding locking protrusion. Each nail includes a main body, a neck section, a protruding section and a cone section. A slot is defined through the lower portion of the section and through the protruding section and the cone section.

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Tu-Chen, Taiwan

Yeu-Lih Lin