Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Yeu-Lih Lin

Tseng-Hsiang Hu

Li-Kuang Tan

Ming Yang

Chin-Lung Chen

Ming-Liang Hao

Shun Chi Dong

Yi-Chyng Fang

Ming Gui Yang

Ai-Min Huang

Tay-Jian Liu

Ching-Bai Hwang

Jing Zhang

Fang-Xiang Yu

Zhi-Jian Peng

Zhi-Ya Yang

Ying-Min Huang

Aimin Huang

Tong-Hua Lin

Chung Yuan Huang

Da-Chang Chou

Shu-Liang Huang

Chung Yuan AHuang

An LED illumination device includes an optical section disposed at a bottom end of the LED illumination device, and in which a light source is provided. A heat dissipation section located adjacent to the optical section includes a plurality of fins thermally contacting the light source. The electrical section is disposed at a top end of the LED illumination device and electrically connects with the light source. The heat dissipation section is disposed between the optical section and the electrical section. The electrical section defines a plurality of air exchanges communicating the inside of the electrical section with the heat dissipation section and a plurality of exhaust ports communicating the inside of the electrical section with an external environment of the LED illumination device.

LED illumination device

A light-emitting diode (LED) assembly includes a heat dissipation device () and at least one LED (). The heat dissipation device has a connecting surface () with circuitry () being directly formed thereon. The at least one LED is electrically connected with the circuitry, and is maintained in thermal and mechanical contact with the connecting surface to dissipate heat generated thereby through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a surface for the LED to be mounted thereon; (B) insulating the surface; (C) forming circuitry on the insulated surface directly to obtain a connecting surface; (D) attaching the LED to the connecting surface of the heat dissipation device thermally and mechanically, and connecting the LED with the circuitry electrically to form the LED assembly.

Light-emitting diode assembly and method of fabrication

A heat dissipating fan includes a housing (), a stator (), a rotor () and a buffer structure. The housing defines an accommodating space () and includes a hollow tube (). The tube encloses first and second bearings () therein. The stator is arranged in the accommodating space and around the tube. The rotor has a shaft rotatably disposed in the first and the second bearings. The buffer structure includes at least a pair of magnets () received in the tube and located between the first and second bearings. Repellent force is generated between the magnets, thereby preventing at least one of the first and the second bearing from being damaged by an accidental force acting thereon.

Buffer structure for heat dissipating fan

An LED assembly includes a packaged LED module () and a heat dissipation device (). The LED module includes at least an LED die therein and a plurality of conductive pins () extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole () therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.

A light emitting diode (LED) assembly includes at least an LED (), a substrate (), a heat dissipation apparatus () and at least one securing frame (). The substrate forms a set of electrical circuitry () thereon. The at least one LED is arranged on a side of the substrate and electrically connected with the set of electrical circuitry of the substrate. The heat dissipation apparatus is arranged on an opposite side of the substrate. The securing frame includes a pressing portion () securing the substrate with the heat dissipation apparatus detachably.

Light-emitting diode assembly

An antenna device () of a consumer electronic product is formed on an outer surface () of a shell () of the electronic product. The shell of the consumer electronic product is adapted for forming an enclosure of an electronic product. The antenna device extends on a planar plane and is integrally formed with and is coated on the outer surface of the shell. A method for making the antenna device includes: (A) providing a consumer electronic product having a shell for forming the antenna device on an outer surface thereof, the shell being adapted for enclosing components of the consumer electronic product therein; (B) coating a copper layer on the outer surface of the shell of the electronic product; (C) forming circuitry out of the copper layer to form the antenna device.

Antenna for electronic product and method for fabricating the same

A heat-pipe type heat sink () includes a plurality of fins (), at least a heat pipe () extending through the fins, and soldering material () disposed between the heat pipe and the fins. Each of the fins defines therein a through hole () and a cutout () adjacent to the through hole. A sidewall of the through hole forms a collar () contacting with the heat pipe, whilst a sidewall of the cutout forms at least a fringe () connecting with the collar. The fringe guides the soldering material in molten state to flow from the cutout towards the collar to fill in a gap formed between the heat pipe and the fins to bond the heat pipe and the fins together after the molten soldering material is cooled.

Heat-pipe type heat sink

A heat dissipating apparatus () includes a base (), a plurality of stacked fins (), and at least a heat pipe (). The base absorbs heat from a heat-generating component. Each of the fins includes a main body (), and a plurality of projection members () extending from the main body. The projection members of a first fin connect the projection members of a second fin. The projection members form a first heat transfer path for transferring heat from the base to the fins. The heat pipe includes a heat-absorbing portion () thermally contacting with the base, and a heat-dissipating portion () contacting with the fins. The heat pipe forms a second heat transfer path for transferring the heat from the base toward the fins.

Heat dissipating apparatus

A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct includes a plurality of first clamping portions, and the mounting frame includes a plurality of second clamping portions corresponding to the first clamping portions. The first clamping portions engage with the second clamping portions to fix the fan duct and the heat sink onto the mounting frame.

Heat dissipation assembly

A heat dissipation device includes a heat sink with a plurality of fins, a fan mounted on a side of the heat sink with a space formed between the heat sink and the fan, and at least one airflow guiding board formed by one end of at least one of the fins. The airflow guiding board extends through the space to connect with the fan. The airflow guiding board can guide the airflow generated by the fan to the heat sink, so as to reduce the loss of the airflow from the edge of the heat sink, and enhance the effect of heat dissipation. Alternatively, the airflow guide board can also function to guide the airflow to cool other heat sinks.

Heat dissipation device

A grease protecting apparatus () includes a heat sink () defining a plurality of receiving cavities () therein, a layer of grease () spread on a surface () of the heat sink, and a grease cover () attached to the surface of the heat sink for protecting the grease from contamination. The cover includes a main body () defining a protecting space () therein for covering the grease, two wings () extending from two opposite sides of the main body, and a plurality of projections () extending from the wings for being snapped in the receiving cavities of the heat sink. The projection has a trapezium-shaped cross section.

Grease protecting apparatus for heat sink

A heat sink clip and an assembly incorporating such clip are provide. The heat sink clip comprises: a body, an actuating member and a movable fastener. The body has a securing portion formed at one end thereof. The actuating member has a hinge portion thereof. The movable fastener is secured to the hinge portion of the actuating member. The actuating member is pivotably mounted to the securing portion of the body in a direction substantially perpendicular to the body, and the actuating member is turnable relative to the body between a locked position and an unlocked position.

Heat sink clip and assembly

A heat dissipation device () includes at least a heat pipe () and a plurality of metal fins () thermally connected to the heat pipe. Each of the metal fins defines therein an aperture (). An extension flange () extends outwardly from the metal fin and surrounds the aperture. The extension flange defines therein a plurality of slits (). The apertures and extension flanges of the metal fins are aligned together. The heat pipe is received in the aligned apertures and soldered by a thermal medium material to the metal fins via the aligned extension flanges. During the soldering process, rosin content contained in the thermal medium material can be discharged away via the slits formed in the extension flange.

Heat dissipation device with heat pipe

A heat dissipation device includes a fin unit (), and at least a heat pipe () including an evaporating section () and at least a condensing section () extending through the fin unit. The fin unit includes a plurality of fins stacked together. Each fin comprises a wavy and a V-shaped section () and a planar section () therebetween. The wavy and V-shaped sections of the fins can guide an airflow flowing into the fin unit to smoothly flow therethrough, and prevent escape of the airflow from lateral directions of the fin unit. Furthermore, the wavy and V-shaped sections increase the heat dissipation area of the fins and strengthen the fins.

A heat sink assembly includes a heat-conductive base (), and a plurality of combined fins () uprightly attached onto the base. Each fin includes a main body (), a bottom flange () extending from the main body, and two lower abutting plates () extending upwardly from the flange. A pair of first locking tabs () is formed from outer sides of the lower abutting plate, and extends into corresponding cutouts () of the main body of an adjacent fin. Two upper abutting plates (') are formed from a top edge of the main body. A second locking tab () extends from an outer side of each upper abutting plate, and into a corresponding notch () of the main body of the adjacent fin. Then, the first and second locking tabs are bent inwardly to abut against the main body of the adjacent fin. Thus, the fins are firmly combined together.

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Taipei Hsien, Taiwan

Yeu-Lih Lin