Samsung Electronics Co., Ltd.

Seoul National University

Yeryung Jeon

Boun Yoon

Wandon Kim

Jin-Young Lee

Seung Hoon Choi

Taek Dong Chung

Jeonghyuk Yim

Bo Yun Kim

Jaeung Koo

Kwansung Kim

Boyun Kim

Jae Gyeong Lee

A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.

Slurry composition and method of manufacturing integrated circuit device by using the same

A semiconductor device and a method of fabricating a semiconductor device, the semiconductor device including a semiconductor substrate including a first region and a second region; an interlayer insulating layer on the semiconductor substrate, the interlayer insulating layer including a first opening on the first region and having a first width; and a second opening on the second region and having a second width, the second width being greater than the first width; at least one first metal pattern filling the first opening; a second metal pattern in the second opening; and a filling pattern on the second metal pattern in the second opening, wherein the at least one first metal pattern and the second metal pattern each include a same first metal material, and the filling pattern is formed of a non-metal material.

Semiconductor device including interconnections having different structures and method of fabricating the same

Growing community of inventors

Suwon, South Korea

Yeryung Jeon