Semes Co., Ltd.

Sungkyunkwan University

Yerim Yeon

Anton Koriakin

Hae-Won Choi

Kihoon Choi

Jeong Ho Cho

Pil Kyun Heo

Jaeseong Lee

Hyun Yoon

Yong-Jun Seo

Youngje Um

Doyeon Kim

Hyungseok Kang

Byeong Geun Kim

Yoonki Sa

Youngran Ko

Dongok Ahn

Jungsuk Goh

Choonghyun Lee

Mong-Ryong Lee

Hong Gi Min

Miyoung Jo

The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

Method and apparatus for treating substrate

A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.

Substrate treating apparatus and substrate treating method

Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a support member which supports a substrate; a treatment liquid discharging member which discharges a treatment liquid containing a monomeric substance to the substrate located in the support member; and a light irradiator which irradiates light to the treatment liquid discharged to the substrate.

Growing community of inventors

Hwaseong-si, South Korea

Yerim Yeon