Lg Innotek Co., Ltd.

Yeong Seok Yu

Do Yub Kim

Se Yeon Choi

Chul Ho Jang

Min Ji Kim

Min Hak Kim

Seung Beom Jeong

The lighting device disclosed in the embodiment includes a substrate, a light emitting device disposed on a lower surface of the substrate, a reflective layer disposed to face a light emitting surface of the light emitting device, a first resin layer disposed between the substrate and the reflective layer, and a light-transmission control layer disposed on an upper surface of the substrate, wherein the light-transmission control layer may include a liquid crystal layer including a cholesteric liquid crystal, and light emitted through the light emitting surface of the light emitting device may be reflected by the reflective layer and be provided to the light-transmission control layer through the substrate.

Lighting device and vehicle lamp having same

According to an embodiment, disclosed is a curing-device comprising: a stage; a light emitting module including a substrate disposed on the stage and a plurality of light emitting elements disposed on the substrate; and a plurality of transparent blocks disposed between the light emitting module and the stage, wherein the substrate includes a plurality of first sections and a plurality of second sections which are disposed in a first direction, the intervals in the first direction between the light emitting elements disposed in the first sections is smaller than the intervals in the first direction between the light emitting elements disposed in the second sections, and the plurality of transparent blocks are disposed on the first sections.

Curing-device

An embodiment comprises: a board; a light-emitting module including at least one light-emitting element arranged in a first region of the board and a driving element, arranged in a second region of the board, for driving the at least one light-emitting element; a heat-dissipating member disposed below the lower surface of the board; and a heat-dissipating pad disposed between the board and the heat-dissipating member, wherein the heat-dissipating pad comprises: a heat-dissipating plate disposed on the upper surface of the heat-dissipating member; and a protruding part protruding from the upper surface of the heat-dissipating plate and supporting the lower surface of the first region of the board, and the lower surface of the board is spaced apart from the heat-dissipating plate.

Growing community of inventors

Seoul, South Korea

Yeong Seok Yu