Samsung Electronics Co., Ltd.

Yeong-seok Kim

Won-keun Kim

Kyung-suk Oh

Hwa-il Jin

Kil-soo Kim

Ji-Han Ko

Su-jung Hyung

Joung-phil Lee

Dong-Kwan Kim

Jae-Choon Kim

Seung-Tae Hwang

Ki-wan Lee

A semiconductor package may include a first semiconductor chip on and electrically connected to a wiring substrate, an intermediate layer on the first semiconductor chip and covering an entire surface of the first semiconductor chip, a second semiconductor chip on the intermediate layer and electrically connected to the wiring substrate, a mold layer on the wiring substrate and covering the first semiconductor chip and the second semiconductor chip, the mold layer including one or more inner surfaces defining a mold via hole that exposes a portion of a surface of the intermediate layer, an electromagnetic shielding layer on the one or more inner surfaces of the mold layer and further on one or more outer surfaces of the mold layer, and a thermal discharge layer on the electromagnetic shielding layer in the mold via hole, such that the thermal discharge layer fills the mold via hole.

Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics

A semiconductor package includes a package substrate, a first semiconductor device arranged on the package substrate, at least one second semiconductor device on the first semiconductor device to partially cover the first semiconductor device from a top down view, a heat dissipating insulation layer coated on the first semiconductor device and the at least one second semiconductor device, a conductive heat dissipation structure arranged on the heat dissipating insulation layer on a portion of the first semiconductor device not covered by the second semiconductor device, and a molding layer on the package substrate to cover the first semiconductor device and the at least one second semiconductor device. The heat dissipating insulation layer is formed of an electrically insulating and thermally conductive material, and the conductive heat dissipation structure formed of an electrically and thermally conductive material.

Semiconductor package and method of manufacturing semiconductor package

A method of manufacturing a semiconductor device may include forming an adhesive film on a surface of a semiconductor chip, mounting the semiconductor chip on a substrate such that the adhesive film contacts an upper surface of the substrate, and bonding the semiconductor chip and the substrate curing the adhesive film by simultaneously performing a thermo-compression process and an ultraviolet irradiation process on the adhesive film disposed between the substrate and the semiconductor chip.

Method of manufacturing semiconductor devices

A display apparatus and method of controlling the display apparatus are provided herein. The display apparatus includes: a display unit; an image receiving unit which receives an image signal from an image source; and an image processing unit which processes the image signal, controls the display unit to display a three-dimensional (3D) image based on the processed image signal, controls the display unit to display a plurality of selectable sub-images which are respectively based on different preset 3D information values, and corrects the 3D image displayed on the display unit based on a 3D information value of a selected sub-image.

Display apparatus and control method thereof

An image apparatus which provides a three-dimensional (3D) picture-in-picture (PIP) image, and an image display method thereof are provided. The image apparatus includes a graphic processor which adds a graphic representation to a main image to be displayed on a display, and a controller which controls the graphic processor to add a 3D form to the main image. Therefore, it is possible to provide a user with a single PIP image in which various sub-images are graphically represented in 3D.

Growing community of inventors

Hwaseong-si, South Korea

Yeong-seok Kim