Suzhou Lekin Semiconductor Co., Ltd.

Lg Innotek Co., Ltd.

Yeong June Lee

Hui Seong Kang

Min Ji Jin

Koh Eun Lee

June O Song

Seung Jae Lee

Won Jung Kim

Bong Kul Min

Jae Joon Yoon

Ga Yeon Kim

Sung Joo Song

Muyng Gi Kim

A light-emitting element package according to an embodiment comprises: a body comprising a cavity; the cavity; a first frame and a second frame arranged on the bottom surface of the cavity; a first metal layer disposed on the first frame; an ultraviolet light-emitting element disposed on the first metal layer; and a second metal layer disposed on the second frame and electrically connected to the second frame, wherein the body comprises a separation portion between the first frame and the second frame, the second metal layer extends over the sloping surface of the cavity and the separation portion of the body, and the second metal layer is spaced apart from the first metal layer in the cavity and surrounds the first metal layer.

Light-emitting element package and light source module

An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.

Semiconductor device package

A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

One embodiment comprises: a body having a cavity which includes a bottom and sides; a light-emitting element arranged within the cavity of the body; a molding part arranged within the cavity so as to seal the light-emitting element; and a lens which includes a light incident surface and a light emitting surface and is arranged on the molding part, wherein the diameter of the light incident surface of the lens is smaller than a maximum diameter of the cavity, and the height of the lens is lower than the diameter of the light incident surface of the lens.

Light-emitting element package

Growing community of inventors

Seoul, South Korea

Yeong June Lee