Dow Corning Corporation

Yeong Joo Lee

Randall Gene Schmidt

Bhukandas Parbhoo

Ann Walstrom Norris

Stanton James Dent

Hongxi Zhang

Andrew James Goodwin

Duan Li Ou

Pierre Maurice Chevalier

Manoj Kumar Chaudhury

Steven Robson

Edward Joseph Benson

Debra Soliz

Anne Dupont

Michael Dean Livingston

A method for preparing flat-top pads in electronic components includes the steps of: a) stencil printing a flat-top deposit of a curable silicone composition onto a first electronic substrate, where the first electronic substrate is selected from a semiconductor die or a semiconductor die attachment member, where stencil printing the flat-top deposit is performed by squeegee through a down-step stencil; b) curing the flat-top deposit to form a flat-top pad; optionally c) adhering a second electronic substrate to the top of the flat-top pad, where the second electronic substrate is selected from a semiconductor die or a semiconductor die attachment member; and optionally d) repeating steps a), b) and c).

Method for making a flat-top pad

A silicone resin, curable to a resin of low coefficient of thermal expansion, high glass transition temperature and high modulus, has the empirical formula(RSiO)(RSiO)(RSiO)(SiO)wherein each R is a hydrocarbon or substituted hydrocarbon group or a hydrogen atom; and a=0.02 to 0.8; b=0 to 0.4; and c+d=0.2 to 0.98, where a+b+c+d=1.0, characterized in that at least 2 mole % of the siloxane units in the resin are of the formula R'SiO, RR&#x2032;SiOor R&#x2032;SiO, wherein each R&#x2032; is an alkenyl group.

Silicone resins

A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor.

Method for creating adhesion during fabrication of electronic devices

A silicone composition comprising (A) 100 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 75 to 150 parts by weight of an organopolysiloxane resin having a number-average molecular weight of from 2,000 to 5,000 and consisting essentially of R.sup.3.sub.2 R.sup.4 SiO.sub.1/2 units and SiO.sub.4/2 units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, R.sup.4 is selected from the group consisting of R.sup.3 and alkenyl, the mole ratio of R.sup.3.sub.2 R.sup.4 SiO.sub.1/2 units to SiO.sub.4/2 units is from 0.6:1 to 1.1:1, and the resin contains an average of from 2.5 to 7.5 mole percent of alkenyl groups; (C) an organohydrogenpolysiloxane having an average of at least three silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from one to three silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; (D) an adhesion promoter in an amount sufficient to effect adhesion of the composition to a substrate; and (E) a hydrosilylation catalyst in an amount sufficient to cure the composition.

Silicone composition, method for the preparation thereof, and silicone

A vacuum dispensable silicone composition comprising (A) a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organopolysiloxane resin consisting essentially of (a) R.sup.3.sub.2 (CH.sub.2 .dbd.CH)SiO.sub.1/2 siloxane units, (b) R.sup.3.sub.3 SiO.sub.1/2 siloxane units, and (c) SiO.sub.4/2 siloxane units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, the mole ratio of the combination of (a) and (b) units to (c) units is from 0.6 to 1.1, and the resin contains 1 to 5 percent by weight of vinyl groups; (C) an organohydrogenpolysiloxane having an average of at least three silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from one to three silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; (D) an adhesion promoter in an amount sufficient to effect adhesion of the composition to a substrate; (E) a hydrosilylation catalyst; (F) a platinum catalyst inhibitor having a boiling point greater than 150 .degree. C. at 0.10 MPa in an amount sufficient to retard curing of the composition at ambient temperature; wherein the composition is substantially free of air.

Vacuum dispensable silicone compositions

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Midland, MI, United States of America

Yeong Joo Lee