Lg Chem, Ltd

Yeong Bong Mok

Seung Min Lee

Se Woo Yang

Hyun Jee Yoo

Sang Min Park

Hyun Suk Kim

Jung Ok Moon

Sung Nam Moon

Chul Min Jeon

Kyung Yul Bae

Jung Woo Lee

Dong Hwan Ryu

Jae Seol Ryu

Moon Cheol Shin

Se Hyun Jang

An encapsulation film, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same, and the encapsulation film which forms a structure capable of blocking moisture or oxygen penetrating from the outside into the organic electronic device, effectively releases the heat accumulated in the organic electronic device, realizes endurance reliability under severe conditions of high temperature and high humidity, and prevents deterioration of the organic electronic device.

Encapsulation film

An encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same are provided. The encapsulation film has excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending caused by CTE mismatch, and overcomes the performance decrease due to reliability degradation, while preventing generation of bright spots in the organic electronic device.

Encapsulation film having excellent reliability, organic electronic device comprising the same, and method for manufacturing organic electronic device

Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsulation layer.

Encapsulation film having moisture adsorbent and metal mesh layer

The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can prevent occurrence of bright spots of the organic electronic device.

Growing community of inventors

Daejeon, South Korea

Yeong Bong Mok