Samsung Display Co., Ltd.

Yeong Bae Lee

Seung Hwan Baek

Seok Hyun Nam

Chan Jae Park

Myeong Ju Shin

Sang Won Lee

Dong Hoon Kim

Dong Hyeon Lee

Jae Sul An

Sang Hyuck Yoon

So Jeong La

Chan-jae Park

Seul Gi Kim

A frame and a light source module having the same are provided. According to embodiments, there is provided a frame comprising a plurality of bodies spaced apart from one another in one direction and connected to one another by a supporter. The plurality of bodies comprises a light emission window formed at an upper part of a body, a light incidence window formed at a bottom part of the body, and a mounting portion formed between the light emission window and the light incidence window, and including a groove that is formed on an inner wall of the body and is recessed horizontally into the body from the light incidence window.

Frame and light source module including the same

A curved backlight unit includes: a light source module; and a light source enhancing member disposed on the light source module, the light source module includes: a substrate; a light emitting part disposed on the substrate; a first reflecting sheet spaced apart from the light emitting part by a predetermined distance and enclosing the light emitting part; a second reflecting sheet contacting the first reflecting sheet; and a wavelength converting part fixed between the first reflecting sheet and the second reflecting sheet and overlapped with the light emitting part.

Curved backlight unit and display device including the same

A light source unit, a method of fabricating the light source unit and a backlight assembly including the light source unit are provided. According to an exemplary embodiment of the inventive concept, there is provided a light source unit, comprising a circuit board, a light-emitting diode ('LED') package configured to be disposed on the circuit board and including an LED chip emitting light, a wavelength conversion member configured to be disposed on the LED package and convert the wavelength of light emitted from the LED chip, and a mold member configured to be interposed between the LED package and the wavelength conversion member and support the wavelength conversion member.

Light source unit, method of fabricating the light source unit and backlight assembly including the light source unit

Provided are a backlight assembly and a display device having the same. A backlight assembly includes a light source unit which emits light, a light guide plate (LGP) including an incident surface upon which light emitted from the light source unit is incident, an opposite surface which faces the incident surface, and an exit surface which connects the incident surface and the opposite surface and from which light incident upon the incident surface exits, a wavelength conversion member which is located on the exit surface and converts a wavelength of light output from the exit surface, and a first reflective member which is located on the opposite surface and reflects light incident upon the opposite surface, wherein the first reflective member includes a plurality of first color patterns which face the opposite surface.

Backlight assembly and display device having the same

A display device includes a bottom chassis on which a light source is disposed, a light guide plate disposed on the bottom chassis and configured to guide light emitted from the light source to a display panel, an optical sheet on the light guide plate, a mold frame coupled to the bottom chassis and including a support unit on which the display panel is disposed, and a light conversion shielding member disposed on a surface of the support unit of the mold frame having a side portion that extends down from the support unit and covers a side surface of the optical sheet.

Display device

A wavelength conversion member, a backlight assembly, and a display device including the same are provided. In one aspect, there is provided a wavelength conversion member comprising a first substrate, a second substrate, a wavelength conversion layer, and a spacer. The second substrate is positioned on the first substrate. The wavelength conversion layer is interposed between the first substrate and the second substrate. The spacer is interposed between the first substrate and the second substrate to constantly keep a distance between the first substrate and the second substrate.

Wavelength conversion member, backlight assembly, and display device including the same

A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.

Growing community of inventors

Suwon-si, South Korea

Yeong Bae Lee