Samsung Electronics Co., Ltd.

Yeon-Sook Kim

Kyoo-chul Cho

Sam-jong Choi

Gi-Jung Kim

Hoe-Sik Chung

Shin-Hyeok Han

A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a marking region which is disposed on a lower side surface of the convex edge. The lower side surface has a wide region where the marking region is located. This wide region has a width that is wider than an upper side surface of the wafer and thus makes a cross-section of a side of the wafer asymmetrical. With the present invention, the entire top surface of the semiconductor wafer can be utilized for a semiconductor chip region and prevents manufacturing problems associated with the uneven nature of the identification indication when the identification is located on the top surface of the wafer.

Growing community of inventors

Gyeonggi-do, South Korea

Yeon-Sook Kim