Skhynix Inc.

Sk Hynic Inc.

Yeon Ok Kim

Yong Zu Kim

Hyang Sook Lee

Sang Eun Chae

Young Lag Cho

Sung Yoon Baek

Ju Hyun Park

Ho Young Song

Sung Ho Woo

Tae Kyo Park

Dae Yon Lee

Sang Hui Jo

Ji Tai Seo

Seong Jin Kim

Hee Sock Park

A semiconductor package may include: a plurality of slave chips stacked over a master chip through a through silicon via (TSV); a first guard unit disposed around each of the slave chips; and a second guard unit formed at a first distance from the first guard unit and disposed at the master chip.

Semiconductor package

A semiconductor package includes a first chip, a second chip stacked over the first chip and having a different size from the first chip, a first guard unit formed in an edge of a chip having a relatively small size of the first chip and the second chip, and a second guard unit formed in an edge of a chip having a relatively large size of the first chip and the second chip. The first guard unit includes an extension pad which expands the size of the chip having the relatively small size to the size of the chip having the relatively large size.

A multi-chip semiconductor apparatus includes a plurality of semiconductor chips stacked and packaged therein, wherein each of the semiconductor chips includes: a through-silicon via (TSV) formed through the semiconductor chip; a probe pad exposed to an outside of the semiconductor chip so as to enable a probing test; a bump pad exposed to the outside of the semiconductor chip and electrically connected to the TSV; and a conductive layer electrically connecting the probe pad and the bump pad inside the semiconductor chip.

Multi-chip semiconductor apparatus

A semiconductor apparatus includes a reservoir capacitor, and the reservoir capacitor includes a plurality of MOS capacitors serially coupled to one another. The plurality of MOS capacitors are arranged in one well.

Semiconductor apparatus

Growing community of inventors

Icheon-si, South Korea

Yeon Ok Kim