Samsung Electronics Co., Ltd.

Sungkyunkwan University

Yeohoon Yoon

Ilho Kim

Chisung Bae

Yoonmyung Lee

Hyungsun Jang

Hyungmin Gi

A semiconductor package is provided. The semiconductor package includes a redistribution structure having a front surface and a rear surface opposite the front surface, the redistribution structure including an insulating layer and a redistribution conductor provided in the insulating layer; a semiconductor chip provided on the rear surface and including a connection pad electrically connected to the redistribution conductor; an encapsulant provided on at least a portion of the semiconductor chip; under-bump metal (UBM) vias extending from the redistribution conductor to the front surface of the redistribution structure within the insulating layer; UBM pads provided on the front surface of the redistribution structure to correspond to the UBM vias, respectively, and each UBM pad of the UBM pads having an exposed surface convexly protruding away from the front surface of the redistribution structure; and a metal bump provided on the UBM pads and contacting the exposed surface of each UBM pad of the UBM pads.

Semiconductor package

A semiconductor package may include a first semiconductor chip, a second semiconductor chip spaced apart from the first semiconductor chip, an adhesive layer including an interposition portion and a side portion, and a molding layer. The molding layer may surround the first semiconductor chip, the second semiconductor chip, and the adhesive layer. The interposition portion may be between the first and second semiconductor chips. The side portion may contact a side surface of the first semiconductor chip and a side surface of the second semiconductor chip. A top surface of the side portion is curved, and an outer side surface of the side portion is flat.

Semiconductor package including adhesive layer and method for manufacturing the same

A semiconductor package includes a chip level unit including a semiconductor chip; a medium level unit; and a solder ball unit. The solder ball unit is to be connected to a circuit substrate. The medium level unit includes: a wiring pad layer on a first protection layer; a second protection layer including a pad-exposing hole on the first protection layer, a post layer in the pad-exposing hole on the wiring pad layer; and a third protection layer including a post-exposing hole on the second protection layer. A width or diameter of the post-exposing hole is smaller than a width or diameter of the pad-exposing hole; and a barrier layer is disposed in the post-exposing hole on the post layer. The solder ball unit includes a solder ball on the barrier layer.

Semiconductor package for improving reliability

An apparatus and method for tracking maximum power are disclosed. The apparatus is configured to track a maximum power at a certain node of an electronic circuit, adjust an impedance of the electronic circuit such that power at the node is maximal, and adjust an impedance of the electronic circuit by comparing power at two points in time to increase power. The apparatus for tracking a maximum power, includes a charge sharing capacitor connected to an initial capacitor in parallel, a first switch disposed between the initial capacitor and an energy harvesting power supply, a second switch disposed between the initial capacitor and the charge sharing capacitor, a third switch disposed between the energy harvesting power supply and a comparator, and a switched-capacitor power converting circuit configured to control the initial capacitor.

Growing community of inventors

Suwon-si, South Korea

Yeohoon Yoon