Stats Chippac Pte. Ltd.

YeoChan Ko

HeeSoo Lee

DeokKyung Yang

JaeHyuk Choi

YongMin Kim

HeeJo Chi

KeoChang Lee

SooSan Park

KyuSang Kim

A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

System-in-package with double-sided molding

A system and method of manufacture of an integrated circuit packaging system includes: a base substrate, the base substrate includes a base terminal; an integrated circuit device on the base substrate; a bottom conductive joint on the base terminal; a conductive ball on the bottom conductive joint, the conductive ball includes a core body; and an interposer over the conductive ball.

Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof

Growing community of inventors

Incheon, South Korea

YeoChan Ko