Lg Innotek Co., Ltd.

Yeo Eun Yoon

Myeong Jeong Kim

Seok Bae

Dong Mug Seong

Jae Man Park

Jun Phill Eom

Jeung Ook Park

Dong Keon Lee

Jong Sik Lee

Jong Heum Yoon

Ho Min Lee

Sang A Ju

Sungjin Yun

Sung Jin Yun

Sanga Ju

Geon Young Kil

Joon Ki Hong

The communication module according to one embodiment of the present invention comprises: a printed circuit board; an antenna unit and electronic components arranged on the printed circuit board; and a sheet layer arranged on the antenna unit and the electronic components, wherein the sheet layer comprises 15-35% of a polymer resin and 65-85 wt % of flat boron nitride, the flat boron nitride has an average particle size (D50) of 40 to 50 &#x3bc;m, a D10 of 10 to 25 &#x3bc;m, and a D90 of 75 to 85 &#x3bc;m, and the &#x3b8;50 of the flat boron nitride is arranged to form an angle of 40&#xb0; or less with horizontal components of the sheet layer.

Airwaves-passing-type heat dissipation sheet and communication module comprising same

A touch window includes a substrate including an available area and an unavailable area; and an electrode layer formed on the substrate, wherein the electrode layer includes a conductive layer and a protective layer formed on the conductive layer, the protective layer is in direct contact with the conductive layer, the protective layer has a thickness different from that of the conductive layer, and the protective layer includes a black-based color.

Touch window

Disclosed are an optical member, a display device including the same, and a method of fabricating the same. The optical member includes a first substrate; a wavelength conversion layer on the first substrate; and a second substrate on the wavelength conversion layer, wherein the wavelength conversion layer includes an oxygen barrier.

Optical member, display device having the same and method of fabricating the same

According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (AlO) groups classified by particle size.

Resin composition, and printed circuit board using same

An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.

Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition

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Seoul, South Korea

Yeo Eun Yoon